ADSP-BF531/ADSP-BF532/ADSP-BF533
18
RISE AND FALL TIME ns (10% to 90%)
16
14
RISE TIME
12
10
FALL TIME
8
6
4
2
0
where:
T
A
= ambient temperature (�½C).
In
through
airflow measurements comply
with JEDEC standards JESD51–2 and JESD51–6, and the junc
tion-to-board measurement complies with JESD51–8. The
junction-to-case measurement complies with MIL-STD-883
(Method 1012.1). All measurements use a 2S2P JEDEC test
board.
Thermal resistance
θ
JA
in
through
is the figure
of merit relating to performance of the package and board in a
convective environment.
θ
JMA
represents the thermal resistance
under two conditions of airflow.
Ψ
JT
represents the correlation
between
T
J
and
T
CASE
.
0
50
100
150
LOAD CAPACITANCE (pF)
200
250
Table 31. Thermal Characteristics for BC-160 Package
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
27.1
23.85
22.7
7.26
0.14
0.26
0.35
Unit
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
Figure 55. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at V
DDEXT
= 2.25 V
14
RISE AND FALL TIME ns (10% to 90%)
12
10
RISE TIME
Ψ
JT
Ψ
JT
FALL TIME
8
Ψ
JT
6
4
2
Table 32. Thermal Characteristics for ST-176-1 Package
Parameter
θ
JA
0
50
100
150
LOAD CAPACITANCE (pF)
200
250
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
34.9
33.0
32.0
0.50
0.75
1.00
Unit
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
0
θ
JMA
θ
JMA
Ψ
JT
Ψ
JT
Ψ
JT
Figure 56. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance
for Driver D at V
DDEXT
= 3.65 V
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
T
J
=
T
CASE
+
(Ψ
JT
×
P
D
)
where:
T
J
= junction temperature (�½C).
T
CASE
= case temperature (�½C) measured by customer at top
center of package.
Ψ
JT
= from
through
P
D
= power dissipation (see
for
the method to calculate
P
D
).
Values of
θ
JA
are provided for package comparison and printed
circuit board design considerations.
θ
JA
can be used for a first
order approximation of
T
J
by the equation:
T
J
=
T
A
+
(θ
JA
×
P
D
)
Table 33. Thermal Characteristics for B-169 Package
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JC
Ψ
JT
Ψ
JT
Ψ
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not Applicable
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
22.8
20.3
19.3
10.39
0.59
0.88
1.37
Unit
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
�½C/W
Rev. E |
Page 48 of 60 |
July 2007
AD [ ANALOG DEVICES ]
