ADG46+1/ADG46+3
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IN1
D1
S1
IN2
D2
S2
PIN 1
INDICATOR
12 S2
11
10 NC
S3
S1 1
ADG4612/
ADG4613
TOP VIEW
(Not to Scale)
V
V
DD
SS
V
V
2
ADG4612/
ADG4613
TOP VIEW
(Not to Scale)
DD
SS
GND
NC
S3
GND 3
S4 4
9
S4
D4
D3
IN3
IN4
NOTES
NC = NO CONNECT
1. EXPOSED PAD TIED TO SUBSTRATE, GND.
2. NC = NO CONNECT.
Figure 3. LFCSP Pin Configuration
Figure 2. TSSOP Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
LFCSP
Mnemonic
IN1
D1
Description
TSSOP
1
15
16
1
Logic Control Input 1. This pin has an internal 400 kΩ pull-down resistor to GND.
Drain Terminal 1. Can be an input or output.
Source Terminal 1. Can be an input or output.
Most Negative Power Supply Potential.
2
3
S1
4
2
VSS
5
6
±
3
4
5
GND
S4
D4
Ground (0 V) Reference.
Source Terminal 4. Can be an input or output.
Drain Terminal 4. Can be an input or output.
8
9
6
±
8
9
10
11
12
13
14
0
IN4
IN3
D3
S3
NC
VDD
S2
D2
IN2
EPAD
Logic Control Input 4. This pin has an internal 400 kΩ pull-down resistor to GND.
Logic Control Input 3. This pin has an internal 400 kΩ pull-down resistor to GND.
Drain Terminal 3. Can be an input or output.
Source Terminal 3. Can be an input or output.
No Connection.
Most Positive Power Supply Potential.
Source Terminal 2. Can be an input or output.
Drain Terminal 2. Can be an input or output.
10
11
12
13
14
15
16
N/A
Logic Control Input 2. This pin has an internal 400 kΩ pull-down resistor to GND.
The exposed pad is connected to the substrate GND. For best heat dissipation, it is
recommended that this pad be connected to GND. If heat dissipation is not a concern,
it is possible to leave the pad floating. Connecting the exposed pad to VSS (if VSS is not
equal to GND) can cause current to flow and can damage the part.
Table 9. ADG4612 Truth Table
ADG4612 INx
Switch Condition
1
0
On
Off
Table 10. ADG4613 Truth Table
ADG4613 INx
S1, S4
Off
On
S2, S3
On
Off
0
1
Rev. 0 | Page 10 of 24
ADI [ ADI ]
