AD9763/AD9765/AD9767
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 4.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
With
Respect To
soldered in a circuit board for surface-mount packages.
Parameter
AVDD
Rating
ACOM
−0.3 V to +6.5 V
Table 5. Thermal Resistance
DVDD1, DVDD2
ACOM
DCOM1/DCOM2 −0.3 V to +6.5 V
DCOM1/DCOM2 −0.3 V to +0.3 V
Package Type
θJA
Unit
48-Lead LQFP
91
°C/W
AVDD
DVDD1/DVDD2
−6.5 V to +6.5 V
MODE,
DCOM1/DCOM2 −0.3 V to DVDD1/
DVDD2 + 0.3 V
CLK1/IQCLK,
CLK2/IQRESET,
WRT1/IQWRT,
WRT2/IQSEL
ESD CAUTION
Digital Inputs
DCOM1/DCOM2 −0.3 V to DVDD1/
DVDD2 + 0.3 V
IOUTA1/IOUTA2
IOUTB1/IOUTB2
REFIO, FSADJ1,
FSADJ2
GAINCTRL, SLEEP
,
ACOM
ACOM
ACOM
−1.0 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
150°C
Junction
Temperature
Storage
Temperature
Range
Lead Temperature
(10 sec)
−65°C to +150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. G | Page 8 of 44
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