AD9708
ABSOLUTE MAXIMUM RATINGS*
Parameter
AVDD
DVDD
ACOM
AVDD
CLOCK, SLEEP
Digital Inputs
IOUTA, IOUTB
COMP1, COMP2
REFIO, FSADJ
REFLO
Junction Temperature
Storage Temperature
Lead Temperature
(10 sec)
With
Respect to
ACOM
DCOM
DCOM
DVDD
DCOM
DCOM
ACOM
ACOM
ACOM
ACOM
Min
–0.3
–0.3
–0.3
–6.5
–0.3
–0.3
–1.0
–0.3
–0.3
–0.3
–65
Max
+6.5
+6.5
+0.3
+6.5
DVDD + 0.3
DVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+0.3
+150
+150
+300
Units
V
V
V
V
V
V
V
V
V
V
°C
°C
°C
PIN FUNCTION DESCRIPTIONS
Pin No. Name
1
2–7
8
9–14, 25
15
DB7
DB6–DB1
DB0
NC
SLEEP
Description
Most Significant Data Bit (MSB).
Data Bits 1–6.
Least Significant Data Bit (LSB).
No Internal Connection.
Power-Down Control Input. Active
High. Contains active pull-down circuit,
thus may be left unterminated if not
used.
Reference Ground when Internal 1.2 V
Reference Used. Connect to AVDD to
disable internal reference.
Reference Input/Output. Serves as
reference input when internal reference
disabled (i.e., Tie REFLO to AVDD).
Serves as 1.2 V reference output when
internal reference activated (i.e., Tie
REFLO to ACOM). Requires 0.1
µF
capacitor to ACOM when internal
reference activated.
Full-Scale Current Output Adjust.
Bandwidth/Noise Reduction Node.
Add 0.1
µF
to AVDD for optimum
performance.
Analog Common.
Complementary DAC Current Output.
Full-scale current when all data bits
are 0s.
DAC Current Output. Full-scale
current when all data bits are 1s.
Internal Bias Node for Switch Driver
Circuitry. Decouple to ACOM with
0.1
µF
capacitor.
Analog Supply Voltage (+2.7 V to
+5.5 V).
Digital Common.
Digital Supply Voltage (+2.7 V to
+5.5 V).
Clock Input. Data latched on positive
edge of clock.
16
REFLO
17
REFIO
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum
ratings for extended periods may effect device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
18
19
FS ADJ
COMP1
28-Lead 300 mil SOIC
θ
JA
= 71.4°C/W
θ
JC
= 23°C/W
28-Lead TSSOP
θ
JA
= 97.9°C/W
θ
JC
= 14.0°C/W
PIN CONFIGURATION
28 CLOCK
27 DVDD
26 DCOM
25 NC
20
21
ACOM
IOUTB
22
23
IOUTA
COMP2
(MSB) DB7 1
DB6 2
DB5 3
DB4 4
DB3 5
DB2 6
24
26
27
28
AVDD
DCOM
DVDD
CLOCK
AD9708
24 AVDD
TOP VIEW 23 COMP2
(Not to Scale) 22 IOUTA
DB1 7
21 IOUTB
20 ACOM
19 COMP1
18 FS ADJ
17 REFIO
16 REFLO
15 SLEEP
DB0 8
NC 9
NC 10
NC 11
NC 12
NC 13
NC 14
ORDERING GUIDE
Temperature
Range
Package
Descriptions
Package
Options*
Model
NC = NO CONNECT
AD9708AR –40°C to +85°C 28-Lead 300 Mil SOIC R-28
AD9708ARU –40°C to +85°C 28-Lead TSSOP
RU-28
AD9708-EB Evaluation Board
*R = Small Outline IC; RU = Thin Small Outline IC.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD9708 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. B
AD [ ANALOG DEVICES ]
