Package Type Package Dimensions
Package Characteristics
Package Footprint
Lead frame
chip scale
package
•ꢀSurface-mountꢀpackage
•ꢀLeadlessꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
8-lead: 2 mm 3 2 mm 3 0.55 mm; 0.5 mm pitch
8-lead: 3 mm 3 3 mm 3 0.75 mm; 0.5 mm pitch
8-lead: 3 mm 3 3 mm 3 0.85 mm; 0.5 mm pitch
(LFCSP)
•ꢀExposedꢀpadꢀforꢀthermal
performance
10-lead: 1.3 mm 3 1.6 mm 3 0.55 mm; 0.4 mm pitch
10-lead: 2 mm 3 2 mm 3 0.55 mm; 0.5 mm pitch
•ꢀPackageꢀsuffixꢀ–ꢀ“CP”
16-lead: 3 mm 3 3 mm 3 0.75 mm; 0.5 mm pitch
16-lead: 4 mm 3 4 mm 3 0.75 mm; 0.65 mm pitch
Wafer level chip
scale package
(WLCSP)
•ꢀSurface-mountꢀpackage
•ꢀBallꢀarray
•ꢀSolderꢀballꢀPb-freeꢀfinish
•ꢀPackageꢀsuffixꢀ–ꢀ“CB”
6-ball: 0.905 mm 3 1.385 mm 3 0.6 mm; 0.4 mm pitch
8-ball: 1.42 mm 3 1.42 mm 3 0.595 mm; 0.5 mm pitch
9-ball: 1.21 mm 3 1.22 mm 3 0.6 mm; 0.4 mm pitch
14-ball: 1.46 mm 3 2.96 mm 3 0.595 mm; 0.5 mm pitch
Operational Amplifier Selection Guide
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ADI [ ADI ]
