Amplifier Packaging
ADI offers a wide variety of plastic packages from through-hole to surface-mount applications. Many of these plastic packages provide cost-
effective solutions to achieving greater board density (surface-mount packages) and high performance. Plastic packages are extensively used
in many of today’s applications.
Analog Devices offers molded plastic packages and the primary materials are a leadframe, die attach material, bond wire, mold compound,
and a Pb-free finish. In order to provide plastic package solutions that do not sacrifice reliability or functionality, Analog Devices continues
to improve on the materials used, whether focusing on leadframe composition for increased thermal conductivity, low stress mold compound
used for large die applications, or low moisture absorption mold compounds for improved reliability.
Improvements in the small surface-mount packages include the introduction of the devices offered in small body size packages. The following
table provides information on smaller plastic packages offered by Analog Devices.
For more information about ADI’s packaging, please refer to: www.analog.com/pcb_design_resources.
Package Type
Package Dimensions
Package Characteristics
Package Footprint
Small outline integrated
circuit (SOIC)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
8-lead: 4.0 mm 3 6.0 mm 3 1.55 mm
14-lead: 8.65 mm 3 6.0 mm 3 1.55 mm
•ꢀPackageꢀsuffix—“R”
Thin shrink small outline
package (TSSOP)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
8-lead: 3.0 mm 3 6.4 mm 3 1.2 mm
14-lead: 5.0 mm 3 6.4 mm 3 1.2 mm
•ꢀPackageꢀsuffix—“RU”
Microsmall outline
package (MSOP)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
8-lead: 3.0 mm 3 4.9 mm 3 1.1 mm
10-lead: 3.0 mm 3 4.9 mm 3 1.1 mm
•ꢀPackageꢀsuffix—“RM”
Small outline transistor
package (SOT-23)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
5-lead: 2.9 mm 3 2.8 mm 3 1.45 mm
6-lead: 2.9 mm 3 2.8 mm 3 1.45 mm
•ꢀPackageꢀsuffix—“RJ”
Thin small outline
transistor package
(TSOT-23)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
5-lead: 2.9 mm 3 2.8 mm 3 1.1 mm
•ꢀPackageꢀsuffix—“UJ”
Thin shrink small outline
transistor package
(SC70)
•ꢀSurface-mountꢀpackage
•ꢀSolderꢀplateꢀPb-freeꢀfinish
•ꢀMoldedꢀpackage
5-lead: 2 mm 3 2.1 mm 3 1.1 mm
•ꢀPackageꢀsuffix—“KS”
www.analog.com/opamps
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