AD7858/AD7858L
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
AV
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DV
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
Analog Input Voltage to AGND . . . . –0.3 V to AV
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . –0.3 V to DV
DD
+ 0.3 V
Digital Output Voltage to DGND . . . –0.3 V to DV
DD
+ 0.3 V
REF
IN
/REF
OUT
to AGND . . . . . . . . . –0.3 V to AV
DD
+ 0.3 V
Input Current to Any Pin Except Supplies
2
. . . . . . .
±
10 mA
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
θ
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 34.7°C/W
Lead Temperature, (Soldering, 10 sec) . . . . . . . . . . +260°C
SOIC, SSOP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . 75°C/W (SOIC) 115°C/W (SSOP)
θ
JC
Thermal Impedance . . . . 25°C/W (SOIC) 35°C/W (SSOP)
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Transient currents of up to 100 mA will not cause SCR latch-up.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7858/AD7858L features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
PIN CONFIGURATIONS
DIP, SOIC, AND SSOP
Model
AD7858AN
AD7858BN
AD7858LAN
3
AD7858LBN
3
AD7858AR
AD7858BR
AD7858LAR
3
AD7858LBR
3
AD7858LARS
3
EVAL-AD7858CB
4
EVAL-CONTROL BOARD
5
Linearity Power
Error
Dissipation Package
1
(LSB)
(mW)
Options
2
±
1
±
1/2
±
1
±
1
±
1
±
1/2
±
1
±
1
±
1
20
20
6.85
6.85
20
20
6.85
6.85
6.85
N-24
N-24
N-24
N-24
R-24
R-24
R-24
R-24
RS-24
CONVST
1
BUSY 2
SLEEP
3
REF
IN
/REF
OUT
4
AV
DD
5
AGND 6
24
SYNC
23 SCLK
22 CLKIN
21 DIN
AD7858/
AD7858L
20 DOUT
TOP VIEW 19 DGND
C
REF1
7 (Not to Scale) 18 DV
DD
17
CAL
16 AIN8
15 AIN7
14 AIN6
13 AIN5
AIN1 9
AIN2 10
AIN3 11
AIN4 12
C
REF2
8
NOTES
1
Linearity error here refers to integral linearity error.
2
N = Plastic DIP; R = SOIC; RS = SSOP.
3
L signifies the low-power version.
4
This can be used as a stand-alone evaluation board or in conjunction with the EVAL-
CONTROL BOARD for evaluation/demonstration purposes.
5
This board is a complete unit allowing a PC to control and communicate with all
Analog Devices evaluation boards ending in the CB designators.
–6–
REV. B
AD [ ANALOG DEVICES ]
