AD7606/AD7606-6/AD7606-4
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
THERMAꢀ RESISTANCE
Table 4.
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages. These
specifications apply to a 4-layer board.
Parameter
Rating
AVCC to AGND
VDRIVE to AGND
−0.3 V to +7 V
−0.3 V to AVCC + 0.3 V
16.5 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to VDRIVE + 0.3 V
−0.3 V to AVCC + 0.3 V
10 mA
Analog Input Voltage to AGND1
Digital Input Voltage to DGND
Digital Output Voltage to GND
REFIN to AGND
Input Current to Any Pin Except Supplies1
Operating Temperature Range
B Version
Table 5. Thermal Resistance
Package Type
θJA
θJC
Unit
64-Lead LQFP
45
11
°C/W
ESD CAUTION
−40°C to +85°C
−65°C to +150°C
150°C
Storage Temperature Range
Junction Temperature
Pb/SN Temperature, Soldering
Reflow (10 sec to 30 sec)
Pb-Free Temperature, Soldering Reflow
ESD (All Pins Except Analog Inputs)
ESD (Analog Input Pins Only)
240 (+0)°C
260 (+0)°C
2 kV
7 kV
1 Transient currents of up to 100 mA do not cause SCR latch-up.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. 0 | Page 11 of 36
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