Data Sheet
AD5232
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Table 3.
Parameter
Rating
VDD to GND
VSS to GND
VDD to VSS
VA, VB, VW to GND
−0.3 V, +7 V
+0.3 V, −7 V
7 V
VSS − 0.3 V, VDD + 0.3 V
AX − BX, AX − WX, BX − WX
Intermittent1
Continuous
Digital Inputs and Output Voltage to GND
Operating Temperature Range2
Maximum Junction Temperature (TJ max)
Storage Temperature Range
Lead Temperature, Soldering
Vapor Phase (60 sec)
Infrared (15 sec)
20 mA
2 mA
−0.3 V, VDD + 0.3 V
−40°C to +85°C
150°C
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
−65°C to +150°C
Package Type
θJA
θJC
Unit
16-Lead TSSOP (RU-16)
150
28
°C/W
215°C
220°C
ESD CAUTION
Package Power Dissipation
(TJ max − TA)/θJA
1 Maximum terminal current is bounded by the maximum current handling of
the switches, maximum power dissipation of the package, and maximum
applied voltage across any two of the A, B, and W terminals at a given
resistance.
2 Includes programming of nonvolatile memory.
Rev. C | Page 7 of 24
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