1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
Outline letter
Descriptive designator
Terminals
Package style
G
H
P
2
MACY1-X8
8
10
8
Can
Flat pack
Dual-in-line
Square leadless chip carrier
GDFP1-F10 or CDFP2-F10
GDIP1-T8 or CDIP2-T8
CQCC1-N20
20
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Input voltage (V ) ..................................................................................................... 40 V dc
IN
Power dissipation (P ) ............................................................................................... 500 mW 2/
D
Output short circuit duration ....................................................................................... Indefinite
Storage temperature range ........................................................................................ -65°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................................ +300°C
Junction temperature (T ) .......................................................................................... +150°C
J
Thermal resistance, junction-to-case (θ ) ................................................................ See MIL-STD-1835
JC
Thermal resistance, junction-to-ambient (θ ):
JA
Case G .................................................................................................................... 150°C/W 2/
Case H .................................................................................................................... 180°C/W 2/
Case P .................................................................................................................... 148°C/W
Case 2 ..................................................................................................................... 95°C/W
1.4 Recommended operating conditions.
Input voltage (V ) ...................................................................................................... +15 V
IN
Ambient operating temperature range (T )................................................................. -55°C to +125°C
A
1.5 Radiation features.
Device type 01:
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)................................ 100 Krads(Si) 3/
Device type 03:
Maximum total dose available (dose rate ≤ 10 mrads(Si)/s)....................................... 50 Krads(Si) 4/
________
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ For case G, derate above +80°C, 6.8 mW/°C. For case H, derate above +85°C, 5.6 mW/°C. For case P, derate above
+75°C, 6.6 mW/°C. For case 2, derate above +72°C, 7.8 mW/°C.
3/ For device type 01, this part may be dose rate sensitive in a space environment and may demonstrate enhanced low dose
rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
4/ For device type 03, radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition D.
SIZE
STANDARD
5962-89479
A
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
REVISION LEVEL
E
SHEET
COLUMBUS, OHIO 43218-3990
3
DSCC FORM 2234
APR 97
ADI [ ADI ]
