Acutechnology Semiconductor Inc.
AQ8211
To this end, the AQ8211 allows for an analog control of the output voltage via the ENABLE pin.
This allows for sequential, ratio-metric and simultaneous sequencing schemes.
5. Protection Diodes
Unlike older regulators, the AQ8211 requires no protection diodes between the ADJ pin and
VOUT or from the VOUT to the VIN to prevent over-stressing the die. Internal resistors are
limiting the internal current paths on the ADJ pin. Therefore, even with capacitors on the ADJ
pin, no protection diode is needed to ensure device safety under short circuit conditions.
External diodes between the VIN and VOUT are not usually needed. Only if high value
output capacitors are used (> 1000uF) and the input is instantaneously shorted to ground,
can damage occur.
6. Thermal Considerations
When an integrated circuit operates with an appreciable current, its junction temperature is
elevated. It is important to quantify its thermal limits in order to achieve acceptable
performance and reliability. This limit is determined by summing the individual parts
consisting of a series of temperature rises from the semiconductor junction to the operating
environment. The heat generated at the device junction flows through the die to the die
attach pad, through the lead frame to the surrounding case material, to the printed circuit
board, and eventually to the ambient environment.
The AQ8211 regulators have internal thermal shutdown to protect the device from over-
heating. Under all possible operating conditions, the junction temperature of the AQ8211
must be lower than 125°C. A heatsink may be required depending on the maximum power
dissipation and maximum ambient temperature of the application.
To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be
calculated:
PD= (Vc-VOUT) IL
where the IL is the load current.
The next parameter, which must be calculated, is the max. allowable temperature rise, T(max):
T(max)=TJ(max)-TA(max)
where TJ(max) is the maximum allowable junction temperature (125°C), and TA(max) is the
maximum ambient temperature, which will be encountered in the application.
Using the calculated values for T(max) and PD, the maximum allowable value for the
junction to ambient thermal resistance (θJA) can be calculated:
θJA=T(max)/ PD
If the maximum allowable value for θJA is found to be greater than the junction to ambient
thermal resistance for the package used, no heatsink is needed since the package alone will
dissipate enough heat to satisfy these requirements.
7. Ultra low Dropout Operation
The AQ8211 allows for ultra low dropout operation by connecting the pin ENABLE to >0.95V + Vout.
This results in a dropout of 350 mV at 500 mA of load current, between Vin and VOUT.
This feature is important when the supply voltage is dropping near the output regulated voltage.
Furthermore if the voltage dropout is low, the internal power dissipation is also reduced and the
thermal requirements of the device are less stringent.
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Rev. 2.1 January 22, 2006
ACUTECH [ ACUTECHNOLOGY SEMICONDUCTOR ]
