Actel Fusion Mixed-Signal FPGAs
Product Ordering Codes
M7AFS600
_
1
FG
G
256
I
Application (ambient temperature range)
Blank = Commercial (0 to +70°C)
I = Industrial (–40 to +85°C)
PP = Pre-Production
ES = Engineering Silicon (room temperature only)
Package Lead Count
Lead-Free Packaging Options
Blank = Standard Packaging
G = RoHS-Compliant (green) Packaging
Package Type
QN = Quad Flat No Lead (0.5 mm pitch)
PQ = Plastic Quad Flat Pack (0.5 mm pitch)
FG = Fine Pitch Ball Grid Array (1.0 mm pitch)
Speed Grade
F = 20% Slower than Standard
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
Part Number
Fusion Devices
AFS090 = 90,000 System Gates
AFS250 = 250,000 System Gates
AFS600 = 600,000 System Gates
AFS1500 = 1,500,000 System Gates
ARM-Enabled Fusion Devices
M7AFS600
M1AFS250
M1AFS600
M1AFS1500
=
=
=
=
600,000 System Gates
250,000 System Gates
600,000 System Gates
1,500,000 System Gates
Notes:
1. DC and switching characteristics for –F speed grade targets are based only on simulation. The characteristics provided for
the –F speed grade are subject to change after establishing FPGA specifications. Some restrictions might be added and
will be reflected in future revisions of this document. The –F speed grade is only supported in the commercial
temperature range.
2. Quad Flat No Lead packages are only offered as RoHS compliant, QNG.
P re li m i n a ry v 1 .7
III
ACTEL [ Actel Corporation ]
