MIL-PRF-38535K
APPENDIX H
H.3.2.1.5 Assembly and packaging. The manufacturer shall demonstrate the quality system and controls, including SPC
and in-process monitoring programs for both in-house assembly line and any/all of their subcontractors performing assembly
processing for SMD products.
H.3.2.1.5.1 Assembly and packaging technology certification. As part of the certification, the manufacturer should identify
the specific assembly technologies that are expected to be listed as part of the technology flow for QML and used in QML
microcircuits. Those processes shall be qualified by addressing, as a minimum, the test in tables H-IA or H-IB as appropriate.
An assembly technology consists of the materials and processes used for wafer saw, die attach, wire bond, flip chip
attachment, package sealing, lead attach, solder dipping, marking, and any other process involved with the construction of the
product. All supporting documentation and data shall be made available to the qualifying activity before or during the
management and technology validation (see G.3.2.2.1).
The following items shall be used as minimum requirements by the manufacturer and the QA in evaluating assembly and
packaging for class level S product:
a. Assembly processes.
(1) Die attach.
(2) Wire bond/bump.
(3) Encapsulation.
(4) Process monitors/SPC.
(5) Inspections.
(6) Tests – Mechanical, thermal, optical.
(7) Lead or column attach.
(8) Incoming tests or review of accompanying C of C on materials (e. package, die attach material, etc.).
b. Package processes and technology.
(1) Design.
(2) Materials selection.
(3) Assembly under supplier control.
(a) By supplier.
(b) Subcontracted.
(4) Thermal characterization.
(a) Hot spots.
(b) Thermal impedance.
(5) Electrical characterization.
(a) At specification levels including voltage, full temperature range, and other excitation conditions.
(b) Beyond specification conditions to determine margin.
(c) Plan to address unspecified or untested parameters (Review analysis to ensure critical untested parameters
are specified or addressed)
(6) Package qualification data.
(a) Incoming package tests on bare package.
(b) Incoming tests on raw materials (e. die attach, etc.)
(c) Mechanical tests.
(d) Thermal tests.
(e) Electrical tests.
(f) Thermal impedance.
(7) Column attachment.
(a) ESD controls.
(b) at 25°C electrical validation pre and post column attach.
(c) Mechanical integrity.
(d) Co-planarity.
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ACTEL [ Actel Corporation ]
