MIL-PRF-38535K
APPENDIX H
e. Physical design.
(1) Foundry physical design guidelines – Handoff to design team
(2) Placement based on partitioning, architecture, I/O location.
(3) Static timing analysis, with iterated placement, cell sizing and routing to achieve timing closure.
f. Release to foundry.
(1) Foundry run rule checks
(2) Critical design/final design review, utilizing foundry checklists.
H.3.2.1.1.3 Package Design. Packages used for QML microcircuits should address the design requirements and
performance characteristics herein. Characterization may be performed by the microcircuit manufacturer, by an external
lab, or by the package supplier. In any case, the manufacturer's assembly of QML microcircuits should address all the
testing requirements herein. The manufacturer shall address package design/construction quality and reliability. The
manufacturer is responsible to maintain documented validation of all characterization methods used, including all
supporting data.
a. Thermal characterization. The thermal resistance should be determined for all packages used in the manufacture
of QML parts. This value may be obtained by direct or indirect measurements, or by simulation tools or
calculations. TM 1012 of MIL-STD-883 may be used for this calculation. If the thermal resistance is obtained by a
calculation or simulation tool, this procedure should be certified. To certify such a method of theoretical
estimation, the manufacturer shall demonstrate a correlation between the theoretically estimated value and the
actual measured value for at least one package of the same style with equal or greater pin count.
b. Electrical characterization. The following electrical characterization parameters should be addressed:
(1) Ground and power supply impedance. Packages used in the manufacture of QML microcircuits should be
minimal contributors to ground and power supply noise. The above requirement can be met either through
the use of documented package design rules or through testing of the packages, either individually or by
similarity, in accordance with TM 3019 of MIL-STD-883.
(2) Cross-coupling effects. Cross-coupling of wideband digital signals and noise between pins in packages used
for digital QML microcircuits should be minimized. The above requirement can be met either through the use
of documented package design rules or through testing the packages, either individually or by similarity, in
accordance with TM 3017 and TM 3018 of MIL-STD-883.
(3) High voltage effects. The voltage applied to a QML package should not produce a surface or bulk leakage
between adjacent package conductors (including leads or terminals). The above requirement can be met
either through the use of documented high voltage package design rules aimed at minimizing bulk or surface
leakage, or through testing of the high voltage packages, either individually or by similarity, in accordance
with TM 1003 of MIL-STD-883.
c. Mechanical characterization. The manufacturer shall perform package mechanical characterization tests which
includes evaluation for shock and vibration to demonstrate the capability to withstand impacts due to moisture
ingression, contamination, corrosion, etc.
156
ACTEL [ Actel Corporation ]
