MIL-PRF-38535K
APPENDIX H
H.3.1.9 Overview of QML Approval Process. The process for achieving QML approval is outlined below in six basic stages
and is further described in detail in the subsequent sections. The stages are listed in the normal sequence to be accomplished;
however, several stages may occur concurrently.
a) Design, wafer fabrication, assembly, and test certification;
1) Design methodologies:
i) Reliability and radiation hardness assurance (RHA) design rules.
2) Wafer fabrication/foundry processes:
i) SPC controls
ii) Metallization controls
iii) Reliability monitors
3) Assembly processes
4) Screening and Test Methodologies
5) Audit/approval
b) Physics-of-failure/TCV reliability assessment;
1) Plan approval
i) Electromigration (EM)
ii) Time dependent dielectric breakdown (TDDB)
iii) Hot carrier injection (HCI)
iv) Threshold voltage instability, including Negative Bias Temperature Instability (NBTI) for 130 nm and
smaller CMOS technologies.
v) Metallization stability over life.
vi) Others as applicable
2) Report approval
c) Process technology validation/SEC qualification;
1) Plan approval
i) Screening flow
ii) Process performance characterizations
iii) Process qualification tests
iv) For class level B products, life test on a minimum of 1 wafer lot for 1000 hrs minimum at 125°C ambient,
or equivalent.
v) For class level S products, long term life test shall meet the requirements of paragraph B.3.4, appendix B,
or shall meet long term life test on a minimum of 1 wafer lot for 4,000 hours minimum at 125°C ambient, or
equivalent.
2) Report approval
d) Product qualification (From existing qualified process technology)
1) Plan approval
i) Screening flow
ii) Product performance characterizations
iii) Product qualification tests
iv) 1,000 hour life test or equivalent
2) Report approval
e) Standard Microcircuit Drawing (SMD)
1) Draft development
2) User coordination
3) SMD release
f) QML listing of approved parts.
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ACTEL [ Actel Corporation ]
