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5962-0421901QYC 参数 Datasheet PDF下载

5962-0421901QYC图片预览
型号: 5962-0421901QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 250000 Gates, 4224-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
CONTENTS  
PARAGRAPH  
PAGE  
J.3.11 In-line TCI testing (option 2)...........................................................................................................................184  
J.3.11.1 Group A electrical testing ............................................................................................................................185  
J.3.11.2 Group C life tests.........................................................................................................................................185  
J.3.12 Test optimization requirements ......................................................................................................................185  
INDEX........................................................................................................................................................................187  
FIGURES  
FIGURE 1. The QML manufacturing line ....................................................................................................................40  
FIGURE 2. Combinations of a manufacturing line.......................................................................................................40  
FIGURE F-1. Lead contact length.............................................................................................................................136  
FIGURE G-1. Generic qualification flow diagram......................................................................................................139  
TABLES  
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................18  
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................19  
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................20  
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................21  
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits..........................22  
TABLE IB. Tests/monitors for plastic packages ..........................................................................................................23  
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................24  
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................25  
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................26  
TABLE II. Group B tests (Mechanical and environmental test) ...................................................................................27  
TABLE III. Group A (electrical tests) ...........................................................................................................................28  
TABLE IV. Group C life tests.......................................................................................................................................29  
TABLE V. Group D tests (Package related test) .........................................................................................................30  
TABLE V. Group D tests (Package related test) .........................................................................................................31  
TABLE V. Group D tests (Package related test) .........................................................................................................32  
TABLE V. Group D tests (Package related test) .........................................................................................................33  
TABLE A-I. Testing guidelines for changes identified as major...................................................................................62  
TABLE A-I. Testing guidelines for changes identified as major...................................................................................63  
FIGURE A-1. Solder dipping area when seating plane is not defined.........................................................................66  
TABLE A-II. Lead finish systems.................................................................................................................................67  
TABLE A-III. Coating thickness and composition requirements..................................................................................68  
TABLE A-IV. Package element (other than leads/terminals) finish systems ...............................................................69  
TABLE A-V. Lead finish ..............................................................................................................................................71  
TABLE A-VI. Digital microcircuits................................................................................................................................82  
TABLE A-VII. Linear microcircuits...............................................................................................................................83  
TABLE A-VIII. Other microcircuits...............................................................................................................................83  
TABLE A-IX. Application specific microcircuits............................................................................................................83  
TABLE A-X. Quality assurance program requirements...............................................................................................90  
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................116  
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................117  
TABLE C-I. Group E (RHA) TCI/QCI test for class Q, class V and class Y...............................................................118  
TABLE D-I. Sample size series (SSS) sampling plan ...............................................................................................123  
TABLE D-II. Hypergeometric sampling plans for small lot sizes of 200 or less.........................................................124  
TABLE D-II. Hypergeometric sampling plans for small homogenous lot sizes of 200 or less ...................................125  
TABLE H-IA. Assembly process technology testing for hermetic and non-hermetic packages.................................172  
TABLE H-IB. Assembly process technology testing for plastic packages .................................................................173  
TABLE H-IIA. Technology characterization testing for hermetic and non-hermetic packages ..................................174  
TABLE H-IIB. Technology characterization testing for plastic packages...................................................................175  
TABLE J-I. End-of-line TCI testing procedure (option 1)...........................................................................................185  
xiv  
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