MIL-PRF-38535K
TABLE II. Group B tests (Mechanical and environmental test)
Group B tests for QML microcircuits
Group B tests for class level B and S microcircuits
(TM 5005 of MIL-STD-883)
Subgroups
1/
(MIL-PRF-38535)
Class Q
Class V
Class Y
Class level B
Class level S
Subgroup 1
Resistance to solvents 2/
TM 2015 3(0)
Resistance to solvents 2/
TM 2015 3(0)
Resistance to solvents 2/
TM 2015 3(0)
a. Physical dimensions
3/
TM 2016
b. Internal water vapor content
TM 1018 3(0) 3/ 4/ 5/
2(0)
(5,000 ppm maximum water
content at 100°C)
Subgroup 2
a. Bond strength
7/
a. Bond strength
7/
a. Bond strength 7/
a. Resistance to
solvents 2/
a. Resistance to solvents 2/
TM 2015 3(0)
6/
TM 2011 22(0)
TM 2011 22(0)
TM 2011
22(0)
(1) Thermo compression -
Test condition C or D
(2) Ultrasonic -
(1) Thermo compression -
Test condition C or D
(2) Ultrasonic -
(1) Thermo compression -
Test condition C or D
(2) Ultrasonic -
TM 2015 3(0)
b. Internal visual and mechanical
TM 2013, TM 2014 2(0)
c. Bond strength 7/
Test condition C or D
(3) Beam lead - Test condition H
Test condition C or D
(3) Beam lead - Test condition H
Test condition C or D
(3) Beam lead - Test condition H
TM 2011
22(0)
(1) Thermo compression -
Test condition C or D
(2) Ultrasonic -
Test condition C or D
(3) Beam lead - Test condition H
b. Die shear test or substrate
attach strength or stud pull test
including passive elements
TM 2019 or TM 2027 3(0)
b. Die shear test or substrate
attach strength or stud pull test
including passive elements
TM 2019 or TM 2027 3(0)
b. Die shear test or substrate
attach strength or stud pull test
including passive elements
TM 2019 or TM 2027 3(0)
d. Die shear test or substrate
attach strength or stud pull test
including passive elements
TM 2019 or TM 2027 3(0)
c. Flip chip pull off test
TM 2031 or TM 2011 2(0)
c. Flip chip pull off test
TM 2031 or TM 2011 2(0)
c. Flip chip pull off test
TM 2031 or TM 2011 2(0)
d. Flip chip die shear strength
test or substrate attach
strength test (test perform post
underfill cure)
d. Flip chip die shear strength
test or substrate attach
strength test (test perform post
underfill cure)
d. Flip chip die shear strength
test or substrate attach
strength test (test perform post
underfill cure)
e. Flip chip pull off test
TM 2031 or TM 2011 2(0)
TM 2019 or TM 2027 3(0)
TM 2019 or TM 2027 3(0)
TM 2019 or TM 2027 3(0)
f. Flip chip die shear strength test
or substrate attach strength test
(test perform post underfill cure)
TM 2019 or TM 2027 3(0)
24
ACTEL [ Actel Corporation ]
