MIL-PRF-38535K
TABLE IB. Tests/monitors for plastic packages. 1/
Test/monitor
MIL-STD-883 test method (TM) or industry standard
1. Wafer acceptance
2. Internal visual
TRB / QM plan (see H.3.2.1.4)
TM 2010 or in accordance with manufacturers internal procedures
3. Temperature cycling/thermal shock
4. Resistance to solvents
5. Bond strength
TM 1010/TM 1011
TM 2015
TM 2011
6. Ball shear
ASTM F1269
TM 2003
7. Solderability
8. Die shear or stud pull
TM 2019 or TM 2027
9. Steady-state life test
End-point electricals
TM 1005
In accordance with device specification
10. Physical dimensions
11. Lead integrity
TM 2016
TM 2004
e.g., TM 1034 (dye penetrant test), cross-sectioning, C-mode
scanning acoustical microscopy (CSAM) TM 2030, etc.
12. Inspection for delamination
JESD22-A118,
100 hours, +130°C, 85% relative humidity (RH) 2/
13. Highly accelerated stress testing (HAST)
14. Autoclave
JESD 22-A102 (no bias) 2 atm., +121°C
TM 1009
15. Salt atmosphere
16. Adhesion to lead finish
17. Interim pre burn-in electricals
18. Burn-in test
TM 2025
In accordance with device specification
TM 1015, 160 hours at +125°C or manufacturers QM plan
In accordance with device specification
1% PDA or manufacturer's QM plan
19. Interim post burn-in electricals
20. PDA or alternate procedure for lot acceptance
21. Final electrical tests (see table III, herein, for
definition of subgroups)
a. static test
In accordance with device specification
b. dynamic test
c. functional test
d. switching test
22. External visual inspection test
TM 2009 or JESD22-B101 or manufacturers internal procedures
1/ Test methods (TMs) are listed herein to give the manufacturer an available method to use. Alternate procedures and test
methods may be used. Monitor frequency and sample plan shall be in accordance with manufacturer's QM plan.
2/ An alternate process monitor may be used; e.g., +85°C/85% relative humidity (RH).
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ACTEL [ Actel Corporation ]
