MIL-PRF-38535K
TABLE IA. Screening procedure for hermetic classes Q, V and non-hermetic class Y microcircuits - Continued.
MIL-STD-883, test method (TM) and conditions
Screening Tests
Class Q
Class V
Class Y
(class level B)
(class level S)
(class level S)
14. Percent defective allowable (PDA)
5 percent PDA
(all lots)
5 percent PDA,
3 percent PDA for functional 3 percent PDA for functional
5 percent PDA,
calculation
17/
parameters at 25°C
(all lots)
parameters at 25°C
(all lots)
In accordance with
applicable device
specification
In accordance with
applicable device
specification
In accordance with
applicable device
specification
15. Final electrical tests 18/
(see table III)
a. Static test :
(see group A test)
(see group A test)
(see group A test)
(1) at 25°C
(2) Maximum and Minimum
operating temperature
b. Dynamic or functional test : 19/
(1) at 25°C
(2) Maximum and Minimum
operating temperature
c. Switching test :
(1) at 25°C
(2) Maximum and Minimum
operated temperature
16. Seal test
a. Fine leak
20/
TM 1014
TM 2009
TM 1014
Not applicable
b. Gross leak
17. Radiographic (X-ray) and/or
X-ray: TM 2012, Two views;
C-SAM TM 2030
X-ray: TM 2012, Two views;
C-SAM TM 2030
C-SAM test
21/
18. External visual inspection
22/ 23/
TM 2009
TM 2009
19. Qualification or quality conformance
inspection/TCI test sample selection
24/
24/
24/
20. Radiation dose rate induced
TM 1020
TM 1020
TM 1020
latch-up test
25/
Note: The screening and QCI/TCI tables from MIL-PRF-38535 and MIL-STD-883 Test Methods 5004 and 5005 have been
combined for consistency. A future revision of MIL-STD-883 will reflect this change as well. Manufacturers shall document in
their QM plan the screening and QCI/TCI requirements to either MIL-PRF-38535 or MIL-STD-883.
19
ACTEL [ Actel Corporation ]
