MIL-PRF-38535K
APPENDIX B
b. Table IV, group C or group B, Subgroup 5 life test requirements shall be met using one of the procedures below.
(1) Life test may be performed on a quantity (accept) criteria of 22(0) for 2000 hours at 125°C or equivalent per TM
1005 to attain 44,000 device hours. For lots greater than 200, actual devices shall be used. For lots less than or
equal to 200, the number of actual devices shall be the greater of 5 devices or 10 percent of the lot, and the SEC
shall supplement actual devices to result in a sample of 22 unless acceptable group C data from the same lot of
SEC is available for the previous 3 months. The SEC shall have been produced under equivalent conditions as
the production lot and as close in time as feasible, but not to exceed a 3 month period.
Note: For ASICs, a sample size of 5 actual devices may be used with the balance being made up of the SEC.
(2) Group C life tests shall be performed on the initial production lot of actual devices from each wafer lot, in
accordance with table IV herein. Group C life tests are not required to be performed on subsequent production
lots when all the following conditions are met:
(a) Subsequent production lots utilize die from the same wafer lot as the initial production lot.
(b) Wafers or die remaining from the initial production lot are to be stored in dry nitrogen or equivalent controlled
storage, and in covered containers.
(c ) No major changes to the assembly processes have occurred since the group C test was performed on the
wafer lot.
c. Table V, group D test requirements for package technology style characterization testing (see table H-IIX), and group D
testing on the initial production lot utilizing the package family of interest, shall be in accordance with MIL-PRF-38535 and
the manufacturer’s approved QM plan. A package family consists of a set of package types with the same package
configuration (e.g., BGA, CGA), material type (e.g., alumina, beryllium oxide (BeO)), package construction techniques (e.g.,
single layer, multilayer), ball (bumps) and column spacing with identical package assembly techniques (e.g., material and
type of seal, ball attach, underfill, solder bumps or wire bond method and wire size, die attach method and material). All
new alternate sources of package elements shall be qualified to the applicable group D tests and shall meet paragraph
H.3.4.4.1.
d. Group E inspection shall be performed in accordance with table C-I of appendix C. Metal oxide semiconductor (MOS)
microcircuits, when specified, shall be tested for time dependent effects post total dose irradiation. When 100 percent latch-
up screen is specified, the PDA shall be 5 percent or one device, whichever is greater. The devices used for group E testing
shall pass the specified group A electrical tests. An alternate procedure to table C-I group E test may be used upon
approval of the qualifying activity.
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ACTEL [ Actel Corporation ]
