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    5962-0422104QUC 参数 Datasheet PDF下载

    5962-0422104QUC图片预览
    型号： 5962-0422104QUC
    PDF下载： 下载PDF文件 查看货源
    内容描述： [Field Programmable Gate Array, 2000000 Gates, 32256-Cell, CMOS, CQFP256, CERAMIC, QFP-256]
    分类和应用： 栅可编程逻辑
    文件页数/大小： 217 页 / 1554 K
    品牌： ACTEL [ Actel Corporation ]
     浏览型号5962-0422104QUC的Datasheet PDF文件第1页浏览型号5962-0422104QUC的Datasheet PDF文件第2页浏览型号5962-0422104QUC的Datasheet PDF文件第3页浏览型号5962-0422104QUC的Datasheet PDF文件第5页浏览型号5962-0422104QUC的Datasheet PDF文件第6页浏览型号5962-0422104QUC的Datasheet PDF文件第7页浏览型号5962-0422104QUC的Datasheet PDF文件第8页浏览型号5962-0422104QUC的Datasheet PDF文件第9页  
    MIL-PRF-38535K
    CONTENTS
    PARAGRAPH
    PAGE
    6.4.16 Die type ............................................................................................................................................................ 36
    6.4.17 Radiation hardness assurance (RHA) .............................................................................................................. 36
    6.4.18 Electrostatic discharge (ESD) sensitivity .......................................................................................................... 36
    6.4.19 Package family ................................................................................................................................................. 36
    6.4.20 Technology flow ............................................................................................................................................... 36
    6.4.21 Qualified Manufacturer's Listing (QML) ............................................................................................................ 36
    6.4.22 Third party design center.................................................................................................................................. 36
    6.4.23 Radiation source of supply (RSS) .................................................................................................................... 36
    6.4.24 Form ................................................................................................................................................................. 36
    6.4.25 Fit ..................................................................................................................................................................... 36
    6.4.26 Function ........................................................................................................................................................... 36
    6.4.27 Class M ............................................................................................................................................................ 37
    6.4.28 Class N............................................................................................................................................................. 37
    6.4.29 Class Q ............................................................................................................................................................ 37
    6.4.30 Class V ............................................................................................................................................................. 37
    6.4.31 Class Y ............................................................................................................................................................. 37
    6.4.32 Class B ............................................................................................................................................................. 37
    6.4.33 Class S ............................................................................................................................................................. 37
    6.4.34 Class T ............................................................................................................................................................. 37
    6.4.35 Qualified manufacturer’s line ............................................................................................................................ 37
    6.4.36 Test optimization .............................................................................................................................................. 37
    6.4.37 Audit team ........................................................................................................................................................ 37
    6.4.38 Class level B .................................................................................................................................................... 37
    6.4.39 Class level S .................................................................................................................................................... 37
    6.4.40 Class level vs Class ......................................................................................................................................... 38
    6.4.41 Second party facility ......................................................................................................................................... 38
    6.4.42 Third party facility ............................................................................................................................................. 38
    6.4.43 New technology................................................................................................................................................ 38
    6.4.44 Mature technology............................................................................................................................................ 38
    6.4.45 Lot date code ................................................................................................................................................... 38
    6.4.46 Storage temperature ........................................................................................................................................ 38
    6.4.47 Multi-product wafer(MPW)................................................................................................................................ 38
    6.4.48 Package integrity demonstration test plan(PIDTP)........................................................................................... 38
    6.5 Discussion ............................................................................................................................................................. 39
    6.6 Additional reference documents ............................................................................................................................ 41
    6.7 Subject term (key word) listing .............................................................................................................................. 42
    6.8 List of acronyms .................................................................................................................................................... 43
    6.9 Environmentally preferable material ...................................................................................................................... 45
    6.10 Changes from previous issue .............................................................................................................................. 45
    A.1 SCOPE ................................................................................................................................................................. 46
    A.1.1 Scope................................................................................................................................................................. 46
    A.2 APPLICABLE DOCUMENTS ................................................................................................................................ 46
    A.2.1 General .............................................................................................................................................................. 46
    A.2.2 Government documents..................................................................................................................................... 46
    A.2.2.1 Specifications, standards, and handbooks...................................................................................................... 46
    A.2.2.2 Other Government documents, drawings, and publications............................................................................ 47
    A.2.3 Non-Government publications ........................................................................................................................... 47
    A.2.4 Order of precedence .......................................................................................................................................... 48
    A.3 REQUIREMENTS ................................................................................................................................................. 48
    A.3.1 General .............................................................................................................................................................. 48
    A.3.1.1 Reference to device specification or drawing.................................................................................................. 48
    A.3.1.2 Conflicting requirements ................................................................................................................................. 49
    A.3.1.3 Terms, definitions, symbols and requirements................................................................................................ 49
    A.3.1.3.1 Microelectronics ........................................................................................................................................... 49
    A.3.1.3.2 Element (of a microcircuit or integrated circuit) ............................................................................................ 49
    iv

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