MIL-PRF-38535K
APPENDIX A
A.2.2.2 Other Government documents, drawings, and publications. The following other Government documents,
drawings, and publications form a part of this document to the extent specified herein. Unless otherwise specified,
the issues of these documents are those cited in the solicitation or contract.
DSCC-VQC-42
- Baseline Sheet for Microcircuits Materials and Construction.
(Copies of DSCC-VQC-42 are available from DLA Land and Maritime (ATTN: DLA Land and Maritime-VQC),
P.O. Box 3990, Columbus, OH 43218-3990.)
QML-38535
- Qualified Manufacturers List of Products Qualified Under Performance Specification
MIL-PRF-38535 Integrated Circuits (Microcircuits) Manufacturing, General
Specification For.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
A.2.3 Non-Government publications. The following documents form a part of this document to the extent specified
herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.
ASTM INTERNATIONAL (ASTM)
ASTM F15
ASTM F30
ASTM B170
ASTM B487
- Standard Specification for Iron-Nickel-Cobalt Sealing Alloy.
- Standard Specification for Iron-Nickel Sealing Alloy.
- Standard Specification for Oxygen-Free Electrolytic Copper-Refinery Shapes.
- Standard Test Method for Measurement of Metal and Oxide Coating Thickness by
Microscopical Examination of a Cross Section.
ASTM B567
ASTM B568
- Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter
Method.
- Standard Test Method for Measurement of Coating Thickness by X-Ray Spectrometry.
(Copies of these documents are available online at http://www.astm.org/ or from ASTM International, 100 Barr
Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959.)
AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)
ANSI/NCSL Z540.3 - Calibration Laboratories and Measuring and Test Equipment - General
Requirements.
(Copies of these documents are available online at http://www.ansi.org/ or from American National Standards
Institute, Incorporated, 25 West 43rd Street, 4th Fl. New York, NY 10036.)
JEDEC – SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC)
JESD471
JESD541
JESD22-A114
JESD31
JESD625
JEP114.01
- Symbol & Label for Electrostatic Sensitive Devices.
- Packaging Material Standards for ESD Sensitive Items.
- Electrostatic Discharge (ESD) Sensitivity Testing Human Body Model (HBM).
- General Requirements for Distributors of Commercial and Military Semiconductors.
- Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices.
- Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training and
Certification.
(Copies of these documents are available online at http://www.jedec.org or from JEDEC – Solid State Technology
Association, 3103 North 10th Street, Suite 240–S, Arlington, VA 22201-2107.)
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ACTEL [ Actel Corporation ]
