MIL-PRF-38535K
INDEX
PARAGRAPH
Traceability
3.11
Traceability
A.3.4.6
B.3.8
Traceability
Traceability
C.4.1
Training and retraining of auditors
Training of operators and inspectors
Transitional certification and qualification
TRB duties
A.4.9.3.1.3
A.4.8.1.2.1.1
H.3.3
C.3.2
TRB duties
G.3.2.2
C.3.2.1
B.3.3
TRB/RSS
Validation (certification)
Verification
4.1
VERIFICATION
A.4
VERIFICATION
B.4
VERIFICATION
C.4
VERIFICATION
F.4
Verification of glassivation layer integrity
Visual examination of bump
Visual examination of encapsulant
Visual inspection of bond
Wafer acceptance plan
Wafer acceptance plan
Wafer fabrication
A.3.5.5.4
F.4.3.1
F.4.5.1
F.4.4.2
C.3.4.1.3
H.3.2.1.4
C.3.4.1.2
H.3.2.2.2
J.3.1.1
6.4.7
Wafer fabrication
Wafer fabrication process
Wafer lot
Wafer lot
A.3.1.3.11
A.3.4.5
A.3.4.1.2.2
A.3.7
Wafer lot acceptance
Wire bonding
Workmanship
201