MIL-PRF-38535K
INDEX
PARAGRAPH
Self audit
A.4.9.2.1
A.4.9.3.7
A.4.9.3.8
A.4.9.3.1
A.4.9.3.6
A.4.9.3.2
A.4.9.1
A.4.9.3.1.4
3.3.3
Self audit areas
Self audit checklist
Self audit program
Self audit report
Self audit representatives
Self audit requirements
Self audit schedule and frequency
Self-assessment program
Self-audit requirements
A.4.9
Serialization
A.3.6.8
B.3.7
Serialization
Single lot sampling method
Solderability
D.4.2
3.10
Solderability
A.4.2
SPC and in process monitoring program
SPC and in process monitoring program
Specifications, standards, and handbooks
Specifications, standards, and handbooks
Specifications, standards, and handbooks
Specifications, standards, and handbooks
Specifications, standards, and handbooks
Specifications, standards, and handbooks
H.3.2.2.1
H.3.2.1.3.1
2.2.1
A.2.2.1
C.2.2.1
F.2.2.1
H.2.2.1
J.2.2.1
D.4
STATISTICAL SAMPLING PROCEDURES AND TABLE
Status report
G.3.2.3
6.4.45
Storage temperature
Subject term (key word) listing
6.7
Substrate (of a microcircuit or integrated circuit)
6.4.3
Substrate (of a microcircuit or integrated circuit)
Symbols
A.3.1.3.3
D.3.2
TABLE A-I. Testing guidelines for changes identified as major
Table A-I.
Table A-II.
TABLE A-II. Lead finish systems
TABLE A-III. Coating thickness and composition
requirements
Table A-III.
TABLE A-IV. Package element (other than leads/terminals)
finish systems
Table A-IV.
Table A-IX
Table A-V.
Table A-VI.
Table A-VII.
Table A-VIII.
Table A-X.
TABLE A-IX. Application specific microcircuits
TABLE A-V. Lead finish
TABLE A-VI. Digital microcircuits
TABLE A-VII. Linear microcircuits
TABLE A-VIII. Other microcircuits
TABLE A-X. Quality assurance program requirements
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ACTEL [ Actel Corporation ]
