MIL-PRF-38535K
INDEX
PARAGRAPH
TABLE C-I. Group E (RHA testing), class Q
Table C-I.
Table D-I.
TABLE D-I. Sample size series (SSS) sampling plan
TABLE D-II. Hypergeometric sampling plans for small lot
sizes of 200 or less
TABLE H-IA. Assembly process qualification testing for
hermetic packages
TABLE H-IB. Assembly process qualification testing for
plastic packages
TABLE H-IIA. Technology style characterization testing for
hermetic packages
Table D-II.
Table H-IA.
Table H-IB.
Table H-IIA.
Table H-IIB.
TABLE H-IIB. Technology style characterization testing for
plastic packages
TABLE IA. Microcircuit screening procedure for hermetic
QML microcircuits
Table IA.
Table IB.
Table II.
Table III.
Table IV.
Table J-I.
Table V.
F.4.2
TABLE IB. Tests/monitors for plastic packages
TABLE II. Group B tests
TABLE III. Group A electrical tests
TABLE IV. Group C tests
TABLE J-I. End-of-line TCI testing procedure (option 1)
TABLE V. Group D tests
Tape
TCI
J.3.9
TCI AND SCREENING INFORMATION
TCI assessment
J.3
3.9.1
TCI reporting
J.3.9.2
H.3.2.2.2.1
H.3.2.2.2
3.9
TCV certification
TCV program
Technology conformance inspection (TCI)
Technology conformance inspection (TCI)
Technology conformance inspection (TCI)
Technology flow
4.3
B.4.2
6.4.20
Technology validation
3.4.1.4
C.3.5.1
F.4.6.3
6.4
Technology validation
Temperature cycle
Terms and definitions
Terms, definitions, and symbols
Test facility change
A.3.1.3
G.3.4.5
A.4.3.4
6.4.35
Test method deviation
Test optimization
Test optimization
J.3.12
Test results
A.4.7
Third party design center
Tightened inspection
6.4.22
D.4.2.6
A.3.5.6.3.5
A.4.8.1.1.9
Tin lead plate
Tool, gauge, and test equipment maintenance and calibration
200
ACTEL [ Actel Corporation ]
