MIL-PRF-38535K
APPENDIX H
TABLE H-IB. Assembly process technology testing for plastic packages . 1/
Group number
1
Process
Test
MIL-STD-883 test method or
industry standard
Die-attach and
interconnect
a. In-line visual inspection
b. In-line bond strength
c. In-line ball bond shear
d. In-line die shear/stud pull
e. Post molding X-ray
a. TM 2010 (die-mount and wire bond)
b. TM 2011
c. ASTM F1269
d. TM 2019 or TM 2027
e. TM 2012
2
3
Die-attach,
interconnect, and
molding
a. Radiography (X-ray)
a. TM 2012 (die-mount and wire bond)
b. TM 2030
b. C-SAM (ultrasonic inspection) etc.
Die-attach,
interconnect, and
molding
a. Temperature cycling
(1,000 cycles)
a. TM 1010 condition C or
JESD22-A104
b. End-point electricals
b. In accordance with device
specification
4
Die-attach,
interconnect, and
molding
a.Thermal shock
(100 cycles)
a.TM 1011 condition C or
JESD22-A106 condition C
5
6
Marking
Resistance to solvents
TM 2015
Storage conditions
High temperature storage
TM 1008,
1,000 hours at +150°C
7
Post burn-in lead
finish
Solderability
TM 2003
solder temperature (+245°C ± 5°C )
1/ The test methods are listed herein to give the manufacturer an available method to use. Alternate procedures or test
methods may be used.
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ACTEL [ Actel Corporation ]
