MIL-PRF-38535K
APPENDIX H
TABLE H-IA. Assembly process technology testing for hermetic and non-hermetic packages.
MIL-STD-883 test method and condition or JEDEC test method 1/
Process
Group
number
Hermetic packages
Non-hermetic packages
1
Die-attach and Where applicable
Where applicable
interconnect
a. Thermal shock TM1011
condition C, 100 cycles
a. Thermal shock TM1011
condition C, 100 cycles
b. End-point electricals test - In accordance
with device specification
c. Radiography (X-ray) TM 2012
or
b. End-point electricals test - In accordance
with device specification
c. Radiography (X-ray) TM 2012
or
C-SAM - TM 2030
C-SAM - TM 2030
d. Bond strength TM 2010
(die-mount and wire bond) plus
Die cracks TM 2011
d. Bond strength TM 2010
(die-mount and wire bond) plus
For die cracks TM 2011
e. Die shear or stud pull TM 2019 or TM 2027 e. Die shear or stud pull TM 2019 or TM2027
f. Flip chip die pull off test TM 2031
(before underfill dispense)
f. Flip chip die pull off test TM 2031
(before underfill dispense)
g. Underfill/epoxy TM 5011
g. Underfill/epoxy TM 5011 and
ASTM E595 for outgassing.
h. Flip chip die shear test TM 2019 or TM 2027 h. Flip chip die shear test TM 2019 or
(after underfill cured)
TM 2027 (after underfill cured)
2
Die-attach,
Where applicable
Where applicable
interconnect
a. Mechanical shock TM 2002, condition B
a. Mechanical shock TM 2002, condition B
b. Variable frequency vibration TM 2007,
condition A
and seal test b. Variable frequency vibration TM 2007,
condition A
c. Constant acceleration TM 2001
d. Fine and gross leak TM 1014
e. Visual inspection TM 1010,
(visual criteria 20X of magnification)
f. End-point electricals test - In accordance with
device specification
c. Constant acceleration TM 2001
d. Not applicable
e. Visual inspection TM 1010,
visual criteria 20X of magnification
f. End-point electricals test - In accordance
with device specification
Internal water vapor TM 1018
Lid seal
3
4
5
Not applicable
(5,000 ppm maximum at +100°C)
Where applicable
Lid seal
Where applicable
Lid torque (glass seal) TM 2024
Lid torque (glass seal) TM 2024
Code marking Where applicable
Resistance to solvents TM 2015
Where applicable
Resistance to solvents TM 2015
6
7
Final package High temperature Storage TM 1008
High temperature Storage TM 1008
(1,000 hours at +150°C)
testing
(1,000 hours at +150°C)
Post burn-in
lead finish
Where applicable
Solderability TM 2003
solder temperature (+245°C ± 5°C )
Where applicable
Solderability TM 2003
solder temperature (+245°C ± 5°C )
1/
The test methods are listed herein to give the manufacturer an available method to use. Alternate procedures or test
methods may be used.
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ACTEL [ Actel Corporation ]
