MIL-PRF-38535K
APPENDIX H
H.3.4.8 Product qualification (extension from existing qualified technology) . If the manufacturer wants to qualify additional
product types from previously QA approved process technologies, the qualification plan shall reference the process technology
information (physics-of-failure, description, etc.) and define the specific characterization, screening, and qualification tests
required for the new product including the life test duration, conditions, and rationale.
a. Product Qualification (Extension from existing qualified process technology)
1) Plan approval
i) Screening flow
ii) Product performance characterization plans and data
iii) Product qualification test plans and data
iv) 1,000 hour life test or equivalent
2) Report approval
b. Product qualification for multi-product wafer (MPW):
1)
2)
When qualifying product from a multi-product wafer (MPW), the manufacturer’s shall determine whether each
product design shall receive all qualification testing separately, or whether commonality of designs shall allow
extension to the other designs on the MPW. Each microcircuit design to be used as an SEC or product shall
receive the full applicable QML approved screening flow.
If any MPW microcircuit design is to be considered for qualification by extension then a technical analysis of the
designs shall be documented and approved by the TRB to determine which design is worst case and
representative of the other microcircuit designs on the same wafer. Microcircuit designs with different levels of
circuit spacing (e.g., digital logic vs. memory cell) or different functionality (e.g., analog to digital converter vs.
transceiver) must be qualified separately.
3)
The following areas shall be evaluated as a minimum to determine if a worst case design is representative of the
MPW for the identified qualification test methods of MIL-STD-883.
i) SEM inspection shall be performed in accordance with TM 2018, (class level S only): Worst case
representative design only.
ii) Life test shall be performed in accordance with TM 1005; Full qualification sample on worst case
representative design only and 5 (five) pieces sample on all other designs also be tested.
iii) Total Ionizing Dose (TID) test shall be performed in accordance with TM 1019; Dose rate Latch-up test
shall be performed in accordance with TM 1020, and Dose rate Upset shall be performed in accordance
with TM 1021 (If applicable): Full qualification sample on worst case representative design and 5 (five)
pieces sample on all other designs.
iv) Electrostatic Discharge (ESD) sensitivity test shall be performed in accordance with TM 3015; Capacitance
in accordance with TM 3012; and Electrical Latch-up: Each buffer type shall be tested for initial
qualification or buffer design changes.
v) Single Event Effects (SEE) test shall be performed in accordance with JESD57 (If applicable):
Manufacturer’s shall test each cell type potentially susceptible for initial qualification or cell design changes.
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ACTEL [ Actel Corporation ]
