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5962-0151801QYC 参数 Datasheet PDF下载

5962-0151801QYC图片预览
型号: 5962-0151801QYC
PDF下载: 下载PDF文件 查看货源
内容描述: [Field Programmable Gate Array, 32000 Gates, 206MHz, 2880-Cell, CMOS, CQFP208, CERAMIC, QFP-208]
分类和应用: 可编程逻辑
文件页数/大小: 217 页 / 1554 K
品牌: ACTEL [ Actel Corporation ]
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MIL-PRF-38535K  
APPENDIX A  
TABLE A-III. Coating thickness and composition requirements.  
Thickness  
(microinch/micrometer)  
Coating  
Coating composition requirements  
Minimum 1/  
Maximum 2/  
Hot solder dip (for all  
round leads) 3/  
60/1.52  
NS  
The solder bath shall have a nominal composition  
of Sn60 or Sn63.  
Hot solder dip (for all  
shapes other than round  
leads which have 25 mil  
pitch) 3/  
150/3.80  
200/5.08  
300/7.62  
NS  
NS  
NS  
The solder bath shall have a nominal composition  
of Sn60 or Sn63.  
The solder bath shall have a nominal composition  
of Sn60 or Sn63.  
Hot solder dip (for all  
shapes other than round  
leads with > 25 mil pitch)  
3/  
Shall consist of 3 to 50 percent by weight lead  
(balance nominally tin) homogeneously co-  
deposited. Shall contain no more than 0.05  
percent by weight co-deposited organic material  
measured as elemental carbon. 5/  
Tin-lead plate (as plated)  
4/  
200/5.08  
50/1.27  
NS  
Tin-lead plate (fused) 4/  
Gold plate  
225/5.72  
Shall contain a minimum of 99.7 percent gold.  
Only cobalt shall be used as the hardener.  
50/1.27  
50/1.27  
350/8.89  
250/6.35  
The introduction of organic addition agents to  
nickel bath is prohibited. Up to 40 percent by  
weight cobalt is permitted as a co-deposit.  
Nickel plate (electroplate)  
Nickel plate (electroless)  
The introduction of organic additive agents to  
nickel bath is prohibited.  
50/1.27  
20/0.51  
20/0.51  
350/8.89  
84/2.13  
84/2.13  
Nickel cladding  
Palladium  
Gold flash palladium  
1/ Package elements having noncompliant coatings are permitted provided they are subsequently hot solder dipped  
in accordance with A.3.5.6.3.4b.  
2/ NS = Not specified.  
3/ See A.3.5.6.3.4.  
4/ See A.3.5.6.3.5.  
5/ The maximum carbon content (and minimum lead content in tin-lead plate) shall be determined by the  
manufacturer on at least a weekly basis. The determination of carbon and lead content may be made by any  
accepted analytical technique (e.g., for carbon: pyrolysis, infrared detection (using an IR212, IR244 infrared  
detector, or equivalent); for lead: X-ray fluorescence, emission spectroscopy) so long as the assay reflects the  
actual content in the deposited finish.  
68  
 
 
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