MIL-PRF-38535K
APPENDIX A
A.3.6.2 PIN. Each microcircuit shall be marked with the complete PIN. The PIN may be marked on more than one
line provided the PIN is continuous except where it "breaks" from one line to another. The PIN system shall be as
described in 3.6.2a and 3.6.2b for microcircuits produced in accordance with this appendix and either an SMD, or
device specification. For devices produced in accordance with this appendix, which are not documented on SMDs,
the PIN shall be the vendor’s generic part number or the contractor’s part number as applicable.
A.3.6.2.1 Military designator. Any device that does not meet all the requirements of this appendix and the
applicable device specification, except as allowed by H.3.3, shall not be marked M38510 and shall not make
reference to MIL-M-38510 or MIL-PRF-38535.
A.3.6.2.2 RHA designator. A "/" or "-" indicates no radiation hardness assurance. Letters M, D, P, L, R, F, G, or H
designator levels are defined in A.3.4.1.3.
A.3.6.2.3 Device specification. When used in association with this specification or appendix (e.g., QML), the
M38510 device specification shall consist of three digits from 001 to 999 as applicable.
A.3.6.2.4 Device type. The device type number shall be as specified in the device specification or SMD. The
numbers shall consist of two digits assigned sequentially, from 01 to 99, within each device specification or SMD.
A.3.6.2.5 Device class. The device class shall be designated by a single letter identifying the quality assurance
level. For devices built compliant to this appendix and documented on a one part-one part number SMD, the device
class designator shall be an 'M'.
A.3.6.2.6 Case outline. The case outline shall be designated by a single letter assigned to each outline.
A.3.6.2.7 Lead finish. Lead frame or terminal material and finish shall be as specified in A.3.5.6. The lead finish
shall be designated by a single letter in table A-V.
TABLE A-V. Lead finish.
Lead finish letter
Lead frame or terminal material and finish (see note below)
Types A, B, C, D, E, F, or G with hot solder dip
A
B
C
D
E
F
Types A, B, C, D, E, F, or G with tin-lead plate
Types A, B, C, D, E, F, or G with gold plate
Types A, B, C, D, E, F, or G with palladium
Types A, B, C, D, E, F, or G with gold flash palladium
Types H, J with tin-lead alloy as applicable to device document.
Types A, B, C, D, E, F or G with finishes A, B, or C (see note below)
X
NOTE: Finish letter "X" shall not be marked on the microcircuit or its packaging. This designation is provided for
use in drawings, part lists, orders, or other documentation where lead finishes A, B, or C are all considered
acceptable and interchangeable without preference. For Government logistic support, the A lead finish shall be
acquired and supplied to the end user when the X is included in the PIN for lead finish. If the PIN is not available
with the A lead finish, the same PIN shall be acquired except with the B or C lead finish designator as determined
by availability. Type C terminal material is a fired on metallization used with leadless chip carriers.
A.3.6.2.8 Drawing designator. For new one part-one part number drawings without existing device specifications,
the first two characters of the drawing designator shall consist of the last two digits of the year and the last three
characters shall consist of unique characters assigned to the drawing by DLA Land and Maritime. When an existing
MIL-M-38510 device specification PIN is converted to a one part-one part number PIN via a substitution statement,
the first two characters of the drawing designator of the one part-one part number shall be replaced with the first two
digits of MIL-M-38510 (e.g., 38), and the last three characters of the one part-one part number shall be replaced with
the three digit identifier assigned to the device specification (e.g., M38510/00101BAC shall become
5962-3800101BAC).
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