1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings (for 2.5V/3.3V/5.0V operating conditions). 4/
DC supply voltage range (V
CCI
) ....................................................... -0.3 to +6.0 V dc
DC supply voltage range (V
CCA
) ...................................................... -0.3 to +3.0 V dc
Input voltage range (V
I
) .................................................................... -0.5 to +6.0 V dc
Input voltage(V
I
) for bi-directional I/Os when using 3.3V PCI ............ -0.5 to (+V
CCI
+0.5) V dc
Output voltage range (V
O
) ................................................................ -0.5 to (+V
CCI
+0.5) V dc
Storage temperature range (V
STG
) .................................................. -65
o
C to +150
o
C
o
Lead temperature (soldering, 10 seconds) ....................................... 300 C
Thermal resistance, junction-to-case (Θ
JC
for Case X and Y) .......... 0.5
o
C/W
Maximum junction temperature (T
J
) ................................................. 150
o
C
1.4 Recommended operating conditions.
3.3V power supply voltage range ...................................................... 3.0 to 3.6 V dc (±10% V
CCI
)
5.0V power supply voltage range ...................................................... 4.5 to 5.5 V dc (±10% V
CCI
)
2.5V power supply voltage range ...................................................... 2.25 to 2.75 V dc (±10% V
CCA
)
Case operating temperature range (T
C
) ........................................... -55
o
C to +125
o
C
Input transition time T
R
and T
F
........................................................ 10 ns 5/
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) .................................... 100 percent 6/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard For Microcircuit Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
www.dodssp.daps.mil
or from the
Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
4/
5/
6/
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
If T
R
and T
F
exceeds the limit of 10 ns, the device manufacturer cannot guarantee device functionality.
100 percent test coverage of blank programmable logic devices.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-01515
SHEET
E
3
ACTEL [ Actel Corporation ]
