SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 7
SW3225□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
Component
20N：2012，2520，3225
10N：1608
5N：1005
The device shall be reflow soldered
adhesion
(230±5℃ for 10 seconds) to a tinned
copper substrate. A dynometer
force gauge shall be applied to
the side of the component . The
device must withstand the minimum
force indicated at left without a failure
of the termination to board
(Push test)
attachment.
Temperature
characteristic
1.There shall be no case
deformation or change in
appearance.
-40℃~125℃
Temp.：50±2℃
R.H.：90~95 %
Time.：96±2 hours
Humidity test
2.Inductance shall not change
more than ±5%
Temp.：-40±2℃
Time.：48±2 hours
Low temperature
storage
3.Q shall not change
more than±10%
-40℃ for 30 minutes.
+125℃ for 30 minutes.
Total：10 cycles
Thermal shock test
Temp.：125±2℃
Time.：48±2 hours
High temperature
storage
Note： Inductors are to be tested after 1 hour at room temperature.
High tempera - ture
load life test
Inductors shall not have a
shorted or open winding.
1.Temp：85±2℃
2.Time：1000±12 hours
3.Load：Allowed DC current
1.Temp：40±2℃
2.R.H.：90-95%
3.Time：1000±12 hours
4. Load：Allowed DC current
Humidity load life
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
