SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
SW3225□□□□L□-□□□
ABC'S DWG NO.
ABC'S ITEM NO.
WOUND CHIP INDUCTOR
Ⅰ CONFIGURATION & DIMENSIONS：
A
A
B
C
D
E
F
G
H
I
:
:
:
:
:
:
:
:
:
3.20±0.2
2.50±0.2
2.10±0.2
1.10
0.50
2.20
1.80
2.80
0.70
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
m/m
R12
Marking
Inductance Code
E
F
E
G
I
I
( PCB Pattern )
Ⅱ SCHEMATIC DIAGRAM：
Ⅲ MATERIALS：
d
a
a
b
c
d
e
Core：Ceramic
WIRE ：Enamelled copper wire (class H)
b
c
Mo / Mn + Ni + Au
Terminal：
Peak Temp：260℃ max.
Encapsulate：Epoxy
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
Temperature
Remark：Products comply with RoHS'
Rising Area
Preheat Area
Reflow Area Forced Cooling Area
requirements
+2.0 ~ 4.0℃
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
/ sec max.
260℃
250
200
150
100
50
230℃
50sec max.
Ⅳ GENERAL SPECIFICATION：
a
Temp rise ：15℃ max.
b
Rated current：Current cause inductance
drop within 10% max.
70sec max.
c
d
Storage temp.：-40℃ ----+125℃
Operating temp.：-40℃----+125℃
50
100
150
Time ( seconds )
200
250
0
AR-001A
ABC [ ABC Taiwan Electronics Corp ]
