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SW3225R39JL 参数 Datasheet PDF下载

SW3225R39JL图片预览
型号: SW3225R39JL
PDF下载: 下载PDF文件 查看货源
内容描述: 绕线型片状电感器 [WOUND CHIP INDUCTOR]
分类和应用: 电感器
文件页数/大小: 8 页 / 624 K
品牌: ABC [ ABC Taiwan Electronics Corp ]
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SPECIFICATION FOR APPROVAL  
REF :  
PROD.  
NAME  
PAGE: 6  
ABC'S DWG NO.  
ABC'S ITEM NO.  
SW3225□□□□L-□□□  
WOUND CHIP INDUCTOR  
RELIABILITY TEST:  
Test items  
Specifications  
Test conditions / Test methods  
L
Q
SRF  
RDC  
Refer to standard electrical  
characteristic list  
HP-4291A With HP-16193 Test fixture .  
HP-4291A With HP-16193 Test fixture.  
HP-8753E  
HP-4338B  
Rated currert  
IDC  
Applied the current to coils the  
inductance change shall be less  
than 10% to initial value and  
temperature rise shall not be  
more than 20℃  
Temperature  
rise test  
20max.  
1.Applied the allowed DC current  
for 10 minutes.  
2.Temperature measure by digtal  
surface thermometer .  
Over load test  
After testInductors shall be no  
evidence of electrical and  
mechanical damage  
Applied 2 times of rated allowed  
DC current to inductor for a  
period of five minutes .  
Withstanding  
voltage test  
After testInductors shall be no  
evidence of electrical and  
mechanical damage  
500VAC between inductor terminals and  
center of case for a maximum 1 minute.  
Insulation  
resistance test  
1000 Mmin.  
100 VDC between inductor  
terminals and center case.  
Vibration test  
1.There shall be no case  
deformation or change in  
appearance.  
1.Amplitude1.5 m/m  
(Low frequency)  
2.Frequency10-55-10Hz/min.  
3.Direction X,Y,Z  
4.Duration 2HRS/X,Y,Z  
2.Inductance shall not change  
more than ±5%  
Vibration test  
(Low frequency )  
Inductors shall be dropped 10  
times from a height of 1m onto  
3cm wooden board .  
3.Q shall not change  
more than±10%  
Resistance to  
soldering heat  
Inductors shall be reflowed onto a P.C. board  
using solder paste. Solder process  
shall be 230for 20±2 seconds  
and 260for 5±2 seconds  
The metalized area must  
have 90% min. solder  
coverage  
Dip pads in flux (Alpha 100 or equiv.) and  
dip in solder pot at 230±5for 5 seconds  
Solderability test  
AR-001A  
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