5SHX 06F6010
Thermal
Maximum rated values
Note 1
Parameter
Junction operating temperature
Storage temperature range
Ambient operational temperature
Characteristic values
Symbol
T
vj
T
stg
T
a
Conditions
min
0
-40
0
typ
max
115
60
60
Unit
°C
°C
°C
Unit
K/kW
K/kW
K/kW
K/kW
Parameter
Symbol
Thermal resistance junction-to-case
R
th(jc)
of GCT
Thermal resistance case-to-
heatsink of GCT
Thermal resistance junction-to-case
of Diode
Thermal resistance case-to-
heatsink of Diode
R
th(ch)
R
th(jc)
Conditions
Double side cooled
Diode not dissipating
min
typ
max
40
16
53
17
Double side cooled
R
th(ch)
GCT not dissipating
Analytical function for transient thermal
impedance:
Z
thJC
(t) =
GCT
i
R
i
(K/kW)
τ
i
(s)
1
25.096
0.5619
∑
i
=
1
2
9.235
n
R
i
(1 - e
- t/
τ
i
)
3
3.727
0.0071
4
1.942
0.0020
0.0721
Diode
i
R
i
(K/kW)
τ
i
(s)
1
33.360
0.5623
2
12.255
0.0723
3
4.854
0.0072
4
2.537
0.0020
Fig. 1
Transient thermal impedance (junction-to-
case) vs. time (max. values)
Max. Turn-off current for Lifetime operation
•
•
•
calculated lifetime of on-board capacitors
20 years
with slightly forced air cooling (air velocity
> 0.5 m/s)
strong air cooling allows for increased
ambient temperature
Fig. 2
Max. turn-off current vs. frequency for lifetime
operation
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.
Doc. No. 5SYA1222-05 Aug 07
page 5 of 13