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5962-8863403YX 参数 Datasheet PDF下载

5962-8863403YX图片预览
型号: 5962-8863403YX
PDF下载: 下载PDF文件 查看货源
内容描述: [EEPROM, 32KX8, 90ns, Parallel, CMOS, CQCC32, CERAMIC, LCC-32]
分类和应用: 可编程只读存储器电动程控只读存储器电可擦编程只读存储器ATM异步传输模式内存集成电路
文件页数/大小: 21 页 / 196 K
品牌: XICOR [ XICOR INC. ]
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1. SCOPE  
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in  
accordance with MIL-PRF-38535, appendix A.  
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:  
5962-88634  
01  
U
A
Drawing number  
Device type  
(see 1.2.1)  
Case outline  
(see 1.2.2)  
Lead finish  
(see 1.2.3)  
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:  
Device  
type  
Generic  
number  
Circuit  
function  
Access Write  
time speed Write mode End of write indicator  
Endurance  
01  
02  
03  
04  
05  
See 6.6  
See 6.6  
See 6.6  
See 6.6  
See 6.6  
32K x 8 EEPROM 120 ns 10 ms  
32K x 8 EEPROM 120 ns 3 ms  
32K x 8 EEPROM 90 ns 10 ms  
byte/page  
byte/page  
byte/page  
byte/page  
byte/page  
DATA polling/toggle bit 10,000 cycles  
DATA polling/toggle bit 10,000 cycles  
DATA polling/toggle bit 10,000 cycles  
DATA polling/toggle bit 10,000 cycles  
DATA polling/toggle bit 10,000 cycles  
32K x 8 EEPROM 90 ns  
3 ms  
32K x 8 EEPROM 70 ns 10 ms  
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:  
Outline letter  
Descriptive designator  
Terminals  
Package style  
U
X
Y
Z
See figure 1  
GDIP1-T28 or CDIP2-T28  
CQCC1-N32  
28  
28  
32  
28  
Pin grid array  
Dual-in-line  
Rectangular leadless chip carrier  
Flat pack  
CDFP4-F28  
1.3 Absolute maximum ratings. 1/  
Supply voltage range (VCC) ........................................................-0.3 V dc to +6.25 V dc  
Storage temperature range........................................................-65°C to +150°C  
Maximum power dissipation (PD) ...............................................1.0 W  
Lead temperature (soldering, 10 seconds).................................+300°C  
Junction temperature (TJ) 2/......................................................+175°C  
Thermal resistance, junction-to-case (θJC).................................See MIL-STD-1835  
Input voltage range (VIL, VIH)......................................................-0.3 V dc to +6.25 V dc  
Data retention ............................................................................20 years (minimum)  
Endurance..................................................................................10,000 cycles (minimum)  
Chip clear voltage (Vh) ...............................................................13.0 V dc  
1.4 Recommended operating conditions. 1/  
Supply voltage range (VCC) ........................................................+4.5 V dc to +5.5 V dc  
Case operating temperature range (TC).....................................-55°C to +125°C  
Input voltage, low range (VIL) .....................................................-0.1 V dc to +0.8 V dc  
Input voltage, high range (VIH) ...................................................+2.0 V dc to VCC + 0.3 V dc  
1/ All voltages are referenced to VSS (ground).  
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in  
accordance with method 5004 of MIL-STD-883.  
SIZE  
STANDARD  
5962-88634  
MICROCIRCUIT DRAWING  
A
REVISION LEVEL  
F
SHEET  
DEFENSE SUPPLY CENTER COLUMBUS  
COLUMBUS, OHIO 43218-3990  
2
DSCC FORM 2234  
APR 97