W19B(L)320ST/B
9.7
9.8
9.9
Chip/Sector Erase Waveform....................................................................................... 45
#Data Polling Waveform (During Embedded Algorithms)............................................ 45
Toggle Bit Waveform (During Embedded Algorithms) ................................................. 46
9.10 DQ 2 vs. DQ6 Waveform.............................................................................................. 46
9.11 Temporary Sector Unprotect Timing Diagram.............................................................. 47
9.12 Sector/Sector Block Protect and Unprotect Timing Diagram ....................................... 47
9.13 Alternate #CE Controlled Write (Erase/Program) Operation Timing............................ 48
10.
11.
12.
13.
LATCHUP CHARACTERISTICS .............................................................................................. 49
CAPACITANCE......................................................................................................................... 49
ORDERING INFORMATION .................................................................................................... 50
PACKAGE DIMENSIONS......................................................................................................... 51
13.1 48-Ball TFBGA (measurements in millimeters)............................................................ 51
13.2 48-Pin Standard Thin Small Outline Package (measured in millimeters) .................... 51
14.
VERSION HISTORY................................................................................................................. 52
Publication Release Date: March 23, 2004
- 3 -
Revision A2
WINBOND [ WINBOND ]
