SM5009 series
PAD LAYOUT
PINOUT
(Unit: µm)
(Top view)
Q
VDD
(920,1220)
H A 5 0 0 9
VDD
1
2
3
4
8
7
6
5
INHN
Y
XT
NC
NC
Q
XTN
VSS
(0,0)
INHN XT XTN VSS
X
Chip size: 0.92 × 1.22mm
Chip thickness: 300 30ꢀm
Chip base: V level
DD
PIN DESCRIPTION and PAD DIMENSIONS
Pad dimensions [µm]
Number
Name
I/O
Description
X
Y
Output state control input. Standby mode when LOW, pull-up resistor built-in.
In the case of the CF5009AL×, the oscillator stops and power-saving pull-up
resistor built in to reduce current consumption at standby mode.
1
INHN
I
195
212
2
3
4
XT
I
Amplifier input.
385
575
766
212
212
212
Crystal oscillator connection pins.
Crystal oscillator connected between XT and XTN
Amplifier output.
XTN
VSS
O
–
Ground
Output. Output frequency (f , f /2, f /4, f /8, f /16, f /32) determined by
O
O
O
O
O
O
5
Q
O
765
1062
internal connection
No connection
No connection
Supply voltage
6
7
8
NC
NC
–
–
–
–
–
–
–
VDD
162
1062
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SEIKO [ SEIKO EPSON CORPORATION ]
