February 2007
rev 1.4
ASM3P2508A
Pin Configuration
1
2
3
4
8
7
6
5
XIN
SCL
XOUT
SDA
V
DD
FOUT2CLK
FOUT1CLK
Pin Description
Pin Name
XIN
Type
Description
I
O
P
O
O
I/O
I
Connection to crystal
Connection to crystal
XOUT
VDD
FOUT1CLK
FOUT2CLK
SDA
Power supply for the analog and digital blocks
Clock output-1 (120MHz) - default
Clock output-2 ( 72MHz / 48MHz)
I2C Data
SCL
I2C Clock
VSS
P
Ground to entire chip
Absolute Maximum Ratings
Symbol
Parameter
Rating
-0.5 to +4.6
-40 to +85
0 to 70
Unit
V
°C
°C
°C
°C
VDD, VIN
TSTG
TA
Voltage on any pin with respect to Ground
Storage temperature
Operating temperature
Ts
TJ
Max. Soldering Temperature (10 sec)
Junction Temperature
260
150
Static Discharge Voltage
TDV
2
KV
(As per JEDEC STD22- A114-B)
Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect
device reliability.
Operating Conditions
Condition /
Symbol
Parameter
Min
Typ
Max
Unit
Description
VDD
Supply Voltage
3.3V ± 10%
3
3.3
3.6
V
TA
Ambient Operating Temperature Range
Crystal Resonator Frequency
Serial Data Transfer Rate
-10
+70
°C
MHz
Kb/s
pF
FXIN
14.31818
Standard Mode
10
100
15
CL
Output Driver Load Capacitance
Peak EMI Reducing Solution
2 of 9
Notice: The information in this document is subject to change without notice.
PULSECORE [ PulseCore Semiconductor ]
