5.0 mm INFRARED EMITTING DIODE
L515EIR1C
REV:A / 1
ySOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
y Solder no closer than 3mm from the
base of the package
y Using soldering flux,” RESIN FLUX”
DIP
SOLDERING
Bath temperature: 260℃
Immersion time: within 5 sec, 1 time
is recommended.
y During soldering, take care not to
press the tip of iron against the
lead.
Soldering iron: 30W or smaller
SOLDERING
T
emperature at tip of iron: 300℃ or lower (To prevent heat from being Soldering time: within 3 sec. transferred directly to the lead, hold
IRON
the lead with a pair of tweezers
while soldering)
1) When soldering the lead of LED in a condition that the package is fixed with a panel (See Fig.1),
be careful not to stress the leads with iron tip.
ꢀ
Lead wries
Panel
(Fig.1)
2) When soldering wire to the lead, work with a Fig (See Fig.2) to avoid stressing the package.
ꢀ
Lead wries
Leave
a
slight
clearance
(Fig.2)
Regarding tinning the leads, compound made of tin ,copper and sliver is proposed with the
temperature of 260℃. The proportion of the alloyed solution is 95.5% tin, 3.5 % copper, 0.5%
silver. The time of tinning is 3 seconds.
DRAWING NO. : DS-23-09-0069
DATE : 2009-08-10
Page : 6
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
