5.0 mm INFRARED EMITTING DIODE
L515EIR1C
REV:A / 1
2) Use LEDs with stand-off (Fig.5) or the tube or spacer made of plastic (Fig.6) to position the
LEDs.
Tube
Stand-off
Fig.6
Fig.5
y FORMING LEAD
1) The lead should be bent at least 2mm away from the package. Bending should be performed
with base fixed to a jig to pliers (Fig.7)
Fig.7
2) Forming lead should be carried our prior to soldering and never during or after soldering.
3) Form the lead to ensure alignment between the leads and the holes on PCB, so that stress
against the LED is prevented. (Fig.8)
DRAWING NO. : DS-23-09-0069
DATE : 2009-08-10
Page :9
PARALIGHT [ PARA LIGHT ELECTRONICS CO., LTD. ]
