Et r on Tech
EM566168
Operating Mode
CS1# CS2 OE# WE# LB# UB# DQ0~DQ7 DQ8~DQ15
Mode
Deselect
Power
Standby
Deep Power Down
Standby
Active
H
X
L
L
L
L
L
L
L
L
L
H
L
X
X
X
H
H
L
X
X
X
H
H
H
H
H
L
X
X
H
L
X
X
H
X
L
High-Z
High-Z
High-Z
High-Z
High-Z
D-out
High-Z
D-out
D-in
High-Z
High-Z
High-Z
High-Z
High-Z
High-Z
D-out
D-out
High-Z
D-in
Deselect
H
H
H
H
H
H
H
H
H
Deselect
Output Disabled
Output Disabled
Lower Byte Read
Upper Byte Read
Word Read
X
L
Active
H
L
Active
L
H
L
Active
L
L
Active
X
X
X
L
H
L
Lower Byte Write
Upper Byte Write
Word Write
Active
L
H
L
High-Z
D-in
Active
L
L
D-in
Active
Note: X=don’t care. H=logic high. L=logic low.
Absolute Maximum Ratings1)
Supply voltage, VCC
-0.2 to +3.6V
Input voltages, V
-0.2 to VCC + 0.3V
-2.0 to +3.6V*
100 mA
IN
Input and output voltages, V , V
IN
OUT
Output short circuit current I
SH
Operating temperature, T
A
°
-25 to +85 C
Storage temperature, T
STRG
°
-65 to +125 C
Soldering Temperature (10s), T
SOLDER
°
240 C
Power dissipation, P
1 W
D
Note: Absolute maximum DC requirements contains stress ratings only. Functional operation at the absolute
maximum limits is not implied or guaranteed. Extended exposure to maximum ratings may affect device
reliability.
Recommended DC Operating Conditions
Symbol
VCC
Parameter
Power Supply Voltage
Ground
Min.
2.7
Typ.
3.0
−
Max.
3.3
Unit
V
VSS
0
0
V
VIH
Input High Voltage
Input Low Voltage
2.2
-0.22)
VCC+0.21)
V
−
VIL
+0.6
V
−
Notes:
1. Overshoot: VCC + 2.0V in case of pulse width ≤ 20ns
2. Undershoot: -2.0V in case of pulse width ≤ 20ns
3. Overshoot and undershoot are sampled, not 100% tested.
Preliminary
3
Rev 0.2
Feb. 2002