ESMT
M24L816512DA
Pin Configuration[2, 3, 4]
48-ball VFBGA
Top View
Product Portfolio Product
Power Dissipation
Operating ICC(mA)
f = 1MHz f = fMAX
VCC Range (V)
Product
Speed(ns)
Standby, ISB2(µA)
Min.
2.7
Typ.
3.0
Max.
3.6
Typ.[5]
Max.
Typ.[5]
Max.
Typ. [5]
Max.
100
55
70
22
17
M24L816512DA
Notes:
2
5
11
55
110(for VCC >3.3V )
2.DNU pins are to be left floating or tied to VSS.
3.Ball G2, H6 are the address expansion pins for the 16-Mbit and 32-Mbit densities respectively.
4.NC “no connect”—not connected internally to the die.
5.Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at VCC = VCC (typ)
and TA = 25°C.
Elite Semiconductor Memory Technology Inc.
Publication Date : Jul. 2008
Revision : 1.1 2/12
ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
