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M11L1644A-50T 参数 Datasheet PDF下载

M11L1644A-50T图片预览
型号: M11L1644A-50T
PDF下载: 下载PDF文件 查看货源
内容描述: [EDO DRAM, 4MX4, 50ns, CMOS, PDSO24, TSOP2-26/24]
分类和应用: 动态存储器光电二极管内存集成电路
文件页数/大小: 16 页 / 200 K
品牌: ESMT [ ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC. ]
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M11B1644A / M11B1644SA  
M11L1644A / M11L1644SA  
Notes :  
1. Enables on-chip refresh and address counters.  
cycle is READ-WRITE and the data output will contain  
data read from the selected cell. If neither of the above  
conditions is met, the state of I/O (at access time and  
IH  
IL  
2. V (min) and V (max) are reference levels for  
measuring timing of input signals. Transition times  
IH  
until CAS and RAS or OE go back to V ) is  
IH  
IL  
are measured between V and V .  
WE  
indeterminate. OE held high and  
taken low  
3. In addition to meet the transition rate specification, all  
after CAS goes low result in a LATE WRITE ( OE -  
controlled) cycle.  
IH  
IL  
input signals must transit between V and V in a  
monotonic manner.  
12. Those parameters are referenced to CAS leading  
RCD  
RCD  
RCD  
4. Assume that t  
< t (max). If t  
is greater than  
WE  
edge in EARLY WRITE cycles and  
leading edge  
the maximum recommended value shown in this  
in LATE WRITE or READ-MODIFY- WRITE cycles.  
RAC  
RCD  
table, t  
will increase by the amount that t  
13. During a READ cycle, if OE is low then taken HIGH  
before CAS goes high, I/O goes open, if OE is tied  
permanently low, a LATE WRITE or READ-MODIFY-  
WRITE operation is not possible.  
exceeds the value shown.  
RCD  
RCD  
5. Assume that t  
t  
(max)  
6. If CAS is low at the falling edge of RAS , data-out  
will be maintained from the previous cycle. To initiate  
a new cycle and clear the data-out buffer, CAS and  
RAS must be pulsed high.  
14. An initial pause of 200µ s is required after power-up  
followed by eight RAS refresh cycles (RAS only or  
CBR) before proper device operation is assured. The  
eight RAS cycle wake-ups should be repeated any  
REF  
RCD  
RCD  
7. Operation within the t  
limit ensures that t  
(max)  
RCD  
can be met, t  
point only ; if t  
(max) is specified as a reference  
time the t  
refresh requirement is exceeded.  
RCD  
RCD  
is greater than the specified t  
WE  
15. WRITE command is defined as  
going low.  
CAC  
(max) limit, access time is controlled by t  
.
16. LATE WRITE and READ-MODIFY-WRITE cycles must  
RAD  
RAD  
8. Operation within the t  
limit ensures that t (max)  
OEH  
have both tOFF2 and t  
met ( OE high during  
RAD  
can be met. t (max) is specified as a reference  
WRITE cycle) in order to ensure that the output buffers  
will be open during the WRITE cycles.  
RAD  
RAD  
point only ; if t  
is greater than the specified t  
AA  
(max) limit, access time is controlled by t .  
17. The I/Os open during READ cycles once tOFF1 or  
tOFF2 occur.  
RCH  
RRH  
9. Either t  
or t  
must be satisfied for a READ cycle.  
OFF1  
10.  
t
(max) defines the time at which the output  
18. Each CAS must meet minimum pulse width.  
19. All IOs controlled by OE , regardless CAS .  
achieves the open circuit condition ; it is not a  
OH  
OL  
reference to V or V .  
20. Self refresh mode is initiated by performing a CBR  
refresh cycle and holding RAS low for the specified  
tRASS. Self refresh mode is terminated by rising RAS  
high for a minimum time of tRPS.  
WCS  
RWD  
AWD  
CWD  
11.  
t
, t  
, t  
and t  
are restrictive operating  
parameters in LATE WRITE and READ-MODIFY-  
WRITE cycle only. If t  
EARLY WRITE cycle and the data output will remain  
WCS  
WCS(min)  
t  
, the cycle is an  
RWD  
an open circuit throughout the entire cycle. If t  
21. For all of the refresh mode except the distributed CBR  
refresh mode, all rows must be refreshed within the  
refresh rate before and after self refresh.  
RWD(min)  
AWD  
tAWD(min)  
CWD  
CWD(min)  
t  
, t  
and t  
t  
, the  
Elite Semiconductor Memory Technology Inc.  
Publication Date : May. 2001  
Revision : 1.1  
6/16