EN5337QI
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the
recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may
impair device life. Exposure to absolute maximum rated conditions for extended periods may affect
device reliability.
PARAMETER
Voltages on PVIN, AVIN, VOUT
SYMBOL MIN
MAX
6.0
UNITS
VIN
-0.5
-0.5
-0.5
-65
V
Voltages on Enable, POK
VIN
V
Voltages on XFB, EAOUT, SYNC, SS
Storage Temperature Range
2.5
V
TSTG
150
150
260
2000
1000
500
°C
°C
°C
V
Maximum Operating Junction Temperature
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
ESD Rating – User pins (based on HBM)
ESD Rating - NC pins (based on HBM)
ESD Rating (based on CDM)
TJ-ABS Max
V
V
Recommended Operating Conditions
PARAMETER
SYMBOL MIN
MAX
UNIT
S
Input Voltage Range
VIN
2.375
0.60
0
5.5
VIN – VDO
3
V
†
Output Voltage Range
Output Current
VOUT
ILOAD
TJ-OP
TAMB
V
A
Operating Junction Temperature
Operating Ambient Temperature
† VDO (drop-out voltage) is defined as (ILOAD x Dropout Resistance). Please see Electrical Characteristics table.
- 40
125
°C
- 40
85
°C
Thermal Characteristics
PARAMETER
Thermal Shutdown
SYMBOL
TSD
MIN
TYP
150
20
MAX
UNITS
°C
Thermal Shutdown Hysteresis
Thermal Resistance: Junction to Ambient (Note 1)
TSDH
°C
30
°C/W
θJA
θJC
Thermal Resistance: Junction to Case
3
°C/W
Note 1: Based on a four layer copper board and proper thermal design in line with JEDEC EIJ/JESD51 standards
©Enpirion 2009 all rights reserved, E&OE
3
www.enpirion.com
02638
6/18/2009
Rev:D