EM198810 Datasheet
INTEGRATED CIRCUIT
Elan Design
3.3 Pads name and location
SYMBOL
PAD no
Center pad position
X;Y in microns
35.837 ; 1622.464
35.836 ; 1498.956
35.837 ; 1378.956
35.387 ; 1257.956
35.383 ; 1018.956
35.837 ; 897.956
PLL_VDD(A)
1
2
3
4
5
6
RF_VSS(A)
VCO_GDD(A)
nc
RF_VSS(A)
ANTb(A)
RF_VSS(A)
ANT(A)
7
8
35.837 ; 778.957
35.789 ; 657.956
RF_VSS(A)
RF_VDD(A)
Injp(A)
9
35.835 ; 583.952
35.837 ; 418.957
35.837 ; 178.096
222.918 ; 35.006
341.926 ; 35.006
462.016 ; 35.006
581.926 ; 35.006
702.926 ; 35.006
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Injp(A)
IF_VDD(A)
VCO_VDD(A)
AMS_AVDD(A)
MONIp(A)
MONIn(A)
TP_BG_IV/TP_VTUNE(A)
BRCLK(D)
BPKTCTL(D)
RXDATA(D)
RXCLK(D)
testse(D)
BXTLEN(D)
TEST1(D)
VDD_DIG(D)
VSS_DIG(D)
BnDEN(D)
TEST2(D)
BDDATA(D)
BDCLK(D)
BnPWR(D)
BDATA1(D)
spi_select(D)
VDD_IO(D)
ckpha(D)
LDO_VDD(A)
LDO_OUT_VDD(A)
LDO_TUNE(A)
AMS_DVSS(A)
AMS_DVDD(A)
XTALO(A)
1464.189 ; 35.005
1584.188 ; 35.006
1820.067 ; 34.006
1940.067 ; 34.006
2081.185 ; 219.891
2081.185 ; 339.891
2081.185 ; 459.891
2081.185 ; 579.891
2081.185 ; 699.891
2081.185 ; 821.027
2081.185 ; 941.027
2081.185 ; 1059.839
2081.185 ; 1179.893
2081.185 ; 1299.893
2081.185 ; 1420.890
2081.185 ; 1539.891
2081.185 ; 1659.889
1885.495 ; 1804.847
1762.415 ; 1804.847
1641.438 ; 1804.847
1445.424 ; 1804.847
1318.773 ; 1803.847
1199.684 ; 1803.847
1075.434 ; 1803.847
955.348 ; 1803.847
833.526 ; 1803.946
671.538 ; 1803.946
550.438 ; 1803.847
XTALI(A)
VCO_VSS(A)
- Table 2 -
3.4 Order information
Type number
Package
Name
Description
EM198810W
EM198810H
QFN32
Plastic, quad flat package; no leads; 32 terminals;
body 5 x 5 x 0.8 mm
Bare die
available
This spec is subject to change
without any notice
8 / 18
24.Dec.2006
ELAN [ ELAN MICROELECTRONICS CORP ]
