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C2M0040120D 参数 Datasheet PDF下载

C2M0040120D图片预览
型号: C2M0040120D
PDF下载: 下载PDF文件 查看货源
内容描述: [N-Channel Enhancement Mode]
分类和应用:
文件页数/大小: 10 页 / 959 K
品牌: CREE [ CREE, INC ]
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Electrical Characteristics (TCꢀ=ꢀ25˚Cꢀunlessꢀotherwiseꢀspecified)  
Symbol  
Parameter  
Min.  
1200  
2.4  
Typ.  
Max. Unit  
Test Conditions  
Note  
V(BR)DSS  
Drain-Source Breakdown Voltage  
V
V
V
VGS = 0 V, IDꢀ=ꢀ50ꢀμA  
2.8  
2.0  
1
VDS = 10 V, ID = 10mA  
VGS(th)  
Gate Threshold Voltage  
Fig. 11  
1.8  
VDS = 10 V, ID = 10mA,TJ = 150 °C  
VDS = 1200 V, VGS = 0 V  
IDSS  
IGSS  
Zero Gate Voltage Drain Current  
Gate-Source Leakage Current  
100  
250  
52  
μA  
nA  
VGS = 20 V, VDS = 0 V  
40  
84  
VGS = 20 V, ID = 40 A  
Fig.  
4,5,6  
RDS(on)  
Drain-Source On-State Resistance  
Transconductance  
mΩ  
100  
VGS = 20 V, ID = 40 A, TJ = 150 °C  
VDS= 20 V, IDS= 40 A  
15.1  
13.2  
gfs  
S
Fig. 7  
VDS= 20 V, IDS= 40 A, TJ = 150 °C  
Ciss  
Coss  
Crss  
Eoss  
td(on)  
tr  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Coss Stored Energy  
Turn-On Delay Time  
Rise Time  
1893  
150  
10  
VGS = 0 V  
Fig.  
17,18  
pF  
VDS = 1000 V  
f = 1 MHz  
AC  
V
= 25 mV  
82  
μJ  
Fig 16  
14.8  
52  
VDD = 800 V, VGS = -5/20 V  
ID = 40 A,  
RG(ext)ꢀ=ꢀ2.5ꢀΩ,ꢀꢀRLꢀ=ꢀ16ꢀΩ  
Timing relative to VDS  
Per IEC60747-8-4 pg 83  
ns  
Fig. 27  
td(off)  
Turn-Off Delay Time  
26.4  
tf  
Fall Time  
34.4  
1.0  
0.4  
1.8  
EON  
EOFF  
RG  
Turn-On Switching Loss  
Turn Off Switching Loss  
Internal Gate Resistance  
VDS = 800 V, VGS = -5/20 V,  
mJ  
Fig. 25  
ID = 40A, RG(ext) =ꢀ2.5Ω,ꢀL=ꢀ80ꢀμH  
,
Ω
f = 1 MHz VAC = 25 mV, ESR of CISS  
Built-in SiC Body Diode Characteristics  
Symbol Parameter  
Typ.  
3.6  
3.3  
54  
Max.  
Unit  
Test Conditions  
Note  
V
V
VGS = - 5 V, ISD = 20 A, TJ = 25 °C  
VGS = - 5 V, ISD = 20 A, TJ = 150 °C  
VSD  
Diode Forward Voltage  
Note 1  
trr  
Reverse Recover time  
ns  
nC  
A
VGS = - 5 V, ISD = 40 A TJ = 25 °C  
VR = 800 V  
dif/dt = 1000 A/µs  
Qrr  
Irrm  
Reverse Recovery Charge  
Peak Reverse Recovery Current  
283  
15  
Note 1  
Note (1): When using SiC Body Diode the maximum recommended VGS = -5V  
Thermal Characteristics  
Symbol Parameter  
Typ.  
Max.  
Unit  
Test Conditions  
Note  
RθJC  
RθJC  
Thermal Resistance from Junction to Case  
Thermal Resistance from Junction to Ambient  
0.34  
0.38  
40  
Fig. 21  
°C/W  
Gate Charge Characteristics  
Symbol Parameter  
Typ.  
Max.  
Unit  
Test Conditions  
Note  
Qgs  
Qgd  
Qg  
Gate to Source Charge  
Gate to Drain Charge  
Gate Charge Total  
28  
37  
VDS = 800 V, VGS = -5/20 V  
ID = 40 A  
nC  
Fig. 12  
Per IEC60747-8-4 pg 21  
115  
2
C2M0040120D Rev -