NE67400, NE67483B
OUTLINE DIMENSIONS (Units in mm)
CHIP DIMENSIONS (Units in µm)
NE67400
PACKAGE OUTLINE 83B
1.88 ± 0.3
450
76
1. Source
2. Drain
3. Source
4. Gate
123
64
60
1
S
122
0.5 ± 0.1
52
54
Drain
Drain
4
2
G
D
1.88 ± 0.3
400
4.0 MIN (ALL LEADS)
S
120
Gate
Gate
40
118
3
1.0 ± 0.1
Source
Source
67
1.45 MAX
70
+0.07
0.1
-0.03
48
18
57
56
44
52
Thickness = 140 µm
ORDERING INFORMATION
: Bonding Area
PART
NUMBER
IDSS (mA)
PACKAGE
OUTLINE
NE67400
20 to 120
20 to 120
00 (CHIP)
NE67483B
83B
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
EXCLUSIVE NORTH AMERICAN AGENT FOR
RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS
CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279
24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM
PRINTED IN USA ON RECYCLED PAPER -3/98
DATA SUBJECT TO CHANGE WITHOUT NOTICE
CEL [ CALIFORNIA EASTERN LABS ]
