1.3 Absolute maximum ratings. 1/
DC supply voltage range (VCC) ..................................................................... -0.5 V dc to +7.0 V dc
Input voltage range (VI) ................................................................................ -0.5 V dc to VCC + 0.5 V dc
Output voltage range (VO) ............................................................................ -0.5 V dc to VCC + 0.5 V dc
Input clamp current (IIC)................................................................................ ±20 mA
Output clamp current (IOC)............................................................................ ±20 mA
Continuous output current (IO) ...................................................................... ±25 mA
Storage temperature range (TSTG)................................................................ -65°C to +150°C
Lead temperature (soldering, 10 seconds) ................................................... 300°C
Thermal resistance, junction-to-case (ΘJC) :
Case X and Z.............................................................................................. See MIL-STD-1835
Case Y and U ............................................................................................. 10°C/W 2/
Maximum junction temperature (TJ).............................................................. +150°C
1.4 Recommended operating conditions.
Supply voltage (VCC)..................................................................................... +4.5 V dc to +5.5 V dc
Case operating temperature range (TC)........................................................ -55°C to +125°C
1.5 Digital logic testing for device classes Q and V.
Fault coverage measurement of manufacturing
logic tests (MIL-STD-883, test method 5012) ............................................. 100 percent 3/
1.6 Radiation features
Maximum total dose available (dose rate = 50 - 300 rads(Si)/s).......................... 300K rads(Si) 4/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil from the
Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ When the thermal resistance for this case is specified in MIL-STD-1835, that value shall supersede the value indicated
herein.
3/ 100 percent test coverage of blank programmable logic devices.
4/ Device electrical characteristics are guaranteed for post irradiation levels at 25°C, in low dose rate environment (post 168
hours, 100°C, biased anneal).
SIZE
STANDARD
5962-92156
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
J
SHEET
3
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
