3.11 Processing options. Since the device is capable of being programmed by either the manufacturer or the user to result in
a wide variety of configurations; two processing options are provided for selection in the contract.
3.11.1 Unprogrammed device delivered to the user. All testing shall be verified through group A testing as defined in 4.4.1
and table IIA.
3.11.2 Manufacturer-programmed device delivered to the user. All testing requirements and quality assurance provisions
herein shall be satisfied by the manufacturer prior to delivery. Manufacturer shall verify design checksum after programming.
4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a. Delete the sequence specified as initial (preburn-in) electrical parameters through interim (postburn-in) electrical
parameters of method 5004 and substitute lines 1 through 6 of table IIA herein.
b. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made
available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases,
and power dissipation, as applicable, in accordance with the intent specified in method 1015.
(1) Dynamic burn-in for device class M (method 1015 of MIL-STD-883, test condition D; for circuit, see 4.2.1b herein).
c. Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b. Constant acceleration method 2001 of MIL-STD-883 shall be performed to condition B for devices built with case
outline X, Y, Z, U, M, T, and N.
c. Binning program performed prior to burn-in.
d. Interim and final electrical test parameters shall be as specified in table IIA herein.
e. Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
f. Additional screening for devices 03, 04, 07, and 08 shall include:
(1) Internal visual, TM 2010 condition A
(2) 100% x-ray (top view only)
(3) 100% PIND (PIND is included for all devices (01 through 08))
(4) Serialization (Serialization is included for all devices (01 through 08))
(5) Static Burn-in, delta, read and record, PDA (3% functional)
SIZE
STANDARD
5962-04221
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
REVISION LEVEL
SHEET
C
8
DSCC FORM 2234
APR 97
ACTEL [ Actel Corporation ]
